I am fortunate to discover and assimilate into a company like ASML immediately after graduation. They have granted me numerous opportunities to travel both domestically and internationally; a core point of interest and deciding factor during initial considerations. For the past four years I am continuously challenged with new roles, projects and obstacles. Working at the core of lithography technology, the DUV process constantly creates new opportunities for growth; most recently that of Taiwan Semiconductor Manufacturing Company.HIGHLIGHTS[] Selected for International Seed team ramp up effort for TSMC, AZ. [] Recognized for development and distribution of LMOS/ONE WoW for Intel in Chandler, AZROLES[] TSMC AZ Seed Team: Collaborate with TSMC Taiwan local team on WoW and produce identical process flows to be utilized in new AZ fab and ensure smooth transition with local and foreign partners.[] LMOS Lean Champion: Deliniate company wide project to Chandler team for improved end-to-end part processing, reduce negative KPI breaches, and influence new software proficiency among shift members.OBSTACLES[] Improving efficiency in response times and diagnostic accuracy for Unscheduled Downs given limited communication and informtion transfer in/out of fab.[] Establish feedback system from learnings generated from both in-field and office mistakes to avoid duplicate instances