Derek Corcoran Email & Phone Number
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Derek Corcoran is listed as Experienced Semiconductor Technologist covering technology development, NPI, volume manufacturing. Able to manage complex cross functional projects across multiple disciplines and geographic regions. at Infineon Technologies Dresden GmbH, a company with 38 employees, based in Caerphilly, Wales, United Kingdom. AeroLeads shows a matched LinkedIn profile for Derek Corcoran.
Derek Corcoran previously worked as Director of External Wafer Manufacturing Operations at Infineon Technologies Dresden Gmbh and IT Project Manager at Woodpecker Flooring. Derek Corcoran holds Hons, Physics, First Class from The University Of Glasgow.
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About Derek Corcoran
An engineering management professional with extensive experience in the semiconductor industry across various geographic regions on many different process technologies and wafer sizes. I am a proven problem solver with an eye for detail and a passion to drive projects to their conclusion. Direct management, coaching and mentoring experience.
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Derek Corcoran work experience
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It Project Manager
Short term contract supporting the team on various IT projects including new product automation in Oracle NetSuite, DX shipping integration using Microsoft Visual Studio, custom built dashboard for Warehouse operations management using Blazor.
Staff Silicon Technology Engineer
- Primary role supporting NPI (new product introduction) across multiple wafer Fab Foundries and related technology and product issues on multiple process technologies (180BCD, 55BCDLite, 22ULL) from product definition.
- Drove the investigation of multiple issues on a new… Show more Primary role supporting NPI (new product introduction) across multiple wafer Fab Foundries and related technology and product issues on multiple process.
- Drove the investigation of multiple issues on a new product operating at the highest voltages used on a BCD technology, working closely with the Foundry as well as key internal stakeholders. Carried out extensive.
- Led the team driving the Foundry to identify the process root cause of RTS (random telegraph signal) noise issue on a new product design. Worked hand in hand with the Foundry to define the splits for root cause.
- Project lead for additional Fab bring-up working with Foundry team to drive process and tool matching criteria, qualification plans and schedules to support additional capacity. Led co-ordination with cross-functional.
- Developed JMP scripts, add-ins and dashboards to automate various aspects of data analysis (WAT, SOA) to significantly reduce repetitive manual data manipulation, standardise report output and increase productivity..
Programme Manager
- Managed the joint development of a key customer’s next generation high speed ESD protection technology utilizing buried layers, EPI & deep trench isolation (DTI).
- Defined all aspects of the project from the initial technology development through to the technology & product qualification.
- Led the technical team for the technology setup from definition phase (module process set up, process integration architecture, reticle design & manufacture, electrical testing) through to… Show more Managed the joint.
- Led the technical team for the technology setup from definition phase (module process set up, process integration architecture, reticle design & manufacture, electrical testing) through to first successful electrical.
Manufacturing Product Engineer
- Worked on the most advanced AI processor, investigating yield loss mechanisms from product manufacturing and testing.
- Setup automated yield reporting systems for both final test and wafer probe.
- Involved in assessing the product reliability and identifying risks and working closely with the test engineer to define improved test screening.
- Supported the characterisation of board level testing and system level performance helping to identify major factors in power consumption… Show more Worked on the most advanced AI processor, investigating yield loss.
- Supported the characterisation of board level testing and system level performance helping to identify major factors in power consumption and performance. Show less
Silicon Technology Engineer
- Foundry interface for the 55nm BCD process transfer from fab in Asia to Europe to support 2nd site qualification for additional capacity. This involved twice weekly calls with the Foundry and frequent on-site visits.
- Managed the project schedule, closely reviewing the technical progress with the Foundry, ensuring the required timescales for qualification were met to support production.
- Worked closely with the planning and project management teams to ensure alignment of… Show more Foundry interface for the 55nm BCD process transfer from fab in Asia to Europe to support 2nd site qualification for.
- Worked closely with the planning and project management teams to ensure alignment of resources and budget in place to meet the required timescales for full qualification. Qualification of process & product achieved in.
- Support for NPI, including E-Test analysis of key qualification lots, interfacing with product and test engineering groups for yield analysis, assembly groups to ensure a smooth transfer from FAB to assembly as wells.
Senior Manager Cs And Ic Device
Ic Device Section Manager
Managing a small team of experienced engineers supporting integration and device issues on 200mm HV CMOS process and more recently, MV GaN process.
Ic Device Section Manager
- Managed a team of 5 experienced engineers and 2 technicians, covering 3 power IC processes (HVIC, LVIC, HCIC) in 2 different fabrication facilities (150mm and 200mm). Responsibilities included new product introduction.
- Led a cross-functional team covering R&D, process integration, product engineering, QA and… Show more Managed a team of 5 experienced engineers and 2 technicians, covering 3 power IC processes (HVIC, LVIC, HCIC) in 2.
- Led a cross-functional team covering R&D, process integration, product engineering, QA and operations to resolve various manufacturing issues, including SPC, scrap and wafer fab yield issues on our state-of-the-art GaN.
- Eliminated a major gate oxide scrap issue on an automotive technology, reducing the scrap rate from 20% to virtually zero in 3 months, resulting in cost savings of >200k$ while avoiding a re-qualification of the.
- Supported the capacity expansion of the HCIC platform qualifying additional tools to support wafer starts approx. 3 times higher than previously while improving yield and scrap performance.
- Led the team of cross functional engineers to resolve a yield loss issue on our most advanced technology, recovering the yields from 50% to > 90% in 3 months, enabling a key customer to release their new product line.
Senior Yield Engineer
Involed in the startup of 90nm production ramp at Intel's 1st 300mm facility in Ireland. Responsibilites included the identification of tool and process issues causing low yield and support of process integration and module improvements.
Principal Engineer
- Worked as a key member of the 0.18um team including mentoring other team members in experimental design and statistical analysis of electrical test and SORT yield/parametric results.
- Drove the use of design of experiment (DOE) methodology for fast and efficient process optimisation for a foundry compatible process.
- Developed an optimised Co silicide process using DOE methodology for analogue product performance, completed in 2 cycles of learning.
- Enabled the 1st time… Show more Worked as a key member of the 0.18um team including mentoring other team members in experimental design and statistical analysis of electrical test and SORT yield/parametric results.
- Enabled the 1st time prototype success with a new customer design with a new resistor and fuse by defining and verifying 2 new mask generation algorithms.
- Project managed several 0.25µm technology transfers, including project planning, chairing weekly customer conference calls and managing the technical progress. Matching of the customer process was completed with only 3.
Device Integration Engineer
- Developed optimised Co salicide process on graded SiGe structures and in-situ As doped polysilicon emitter process for inclusion in the full SiGe BiCMOS production processes in National Semiconductor, Santa Clara using.
- Carried out electrical characterisation and co-ordinated the material characterisation of the SiGe deposition process (selective and non-selective processes).
- Defined splits for process characterisation, including wafer processing and… Show more
- Defined splits for process characterisation, including wafer processing and measurement of the growth process for an advance SiGe BiCMOS process. Show less
Derek Corcoran education
Frequently asked questions about Derek Corcoran
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What company does Derek Corcoran work for?
Derek Corcoran works for Infineon Technologies Dresden GmbH.
What is Derek Corcoran's role at Infineon Technologies Dresden GmbH?
Derek Corcoran is listed as Experienced Semiconductor Technologist covering technology development, NPI, volume manufacturing. Able to manage complex cross functional projects across multiple disciplines and geographic regions. at Infineon Technologies Dresden GmbH.
Where is Derek Corcoran based?
Derek Corcoran is based in Caerphilly, Wales, United Kingdom while working with Infineon Technologies Dresden GmbH.
What companies has Derek Corcoran worked for?
Derek Corcoran has worked for Infineon Technologies Dresden Gmbh, Woodpecker Flooring, Cirrus Logic, Newport Wafer Fab Limited, and Graphcore.
How can I contact Derek Corcoran?
You can use AeroLeads to view verified contact signals for Derek Corcoran at Infineon Technologies Dresden GmbH, including work email, phone, and LinkedIn data when available.
What schools did Derek Corcoran attend?
Derek Corcoran holds Hons, Physics, First Class from The University Of Glasgow.
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