Derek Schmidt Email & Phone Number

Chippewa Falls, Wi, Us

Lancaster, New York, Us

Houston, Texas, Us

Houston, Texas, Us

Product Manager and Technical Lead for Exascale Infrastructure Platform Development- Managed the Exascale Infrastructure Platform release to production for general availability- Drove senior level engineers to develop Follow-on technologies for increased performance of the Exascale Infrastructure Platform.- Reported to Oakridge National Laboratory (ORNL), Argonne National Laboratory (ANL), Lawrence Livermore National Laboratory (LLNL), and National Energy Research Scientific Computing Center (NERSC) on program status for the CORAL2 Contracts and other Exascale System Contracts.- Owner of a $2.1M NRE enhancement delivery to DOE of the Exascale Compute Platform. Hardware Engineering Manager for Exascale Platform Development- Led a team of Mechanical, Thermal, and Power engineers to develop compute blades for Exascale Computing Portfolio with GPUs, ARM, and x86 CPU architectures- Led my team through the transition from CRAY to HPE during the acquisition of our company.- Drove cost reduction opportunities while maintaining project schedules and development during COVID-19 pandemic safety restrictions.

Houston, Texas, Us

Product Manager and Technical Lead for Exascale Infrastructure Platform Development- Led a cross functional team from Marketing, Manufacturing, Compliance, R&D, and the Program Management Office to deliver on program technical, financial, and schedule requirements to win multiple Department of Energy Contracts (DOE) driving more than $1.5B in revenue (Frontier System, El Capitan System, Aurora System, and the Perlmutter System)- Reviewed product roadmaps and provided technical insight for Marketing planning.Hardware Engineering Manager for Exascale Platform Development- Led a team of Mechanical, Thermal, and Power engineers to develop direct liquid cooled next generation technologies for all Exascale Compute and Network Technologies - Exascale Infrastructure (Compute cabinet and CDU) - Slingshot High Speed Network Switches (19” Rack and Custom Exascale Platform Enclosures) - Compute Blades including the first AMD EPYC CPU Blade and NVIDIA Ampere GPUs. - Led senior level engineers in architectural investigations for follow-on Exascale projects.- Managed team members from multiple geographic sites and mentor them in their career goals.- Hired and mentored new talent to support new programs and projects.- Managed team member assignments to deliver career growth opportunities while ensuring the best talent was assigned to each program.- Participated in multi-discipline discussions to define Next Generation Platform Design Requirements- Generated 3D Design Concepts for Exascale Compute Blade Portfolio (x86, GPU, and ARM based products).

Houston, Texas, Us

- Mechanical Lead for CRAY XC50 Super Computer Infrastructure- Mechanical Lead for Department of Defense (DOD) Custom Development Projects (Direct Liquid Cooled Infrastructure and )

Morrisville, Nc, Us

eXFlash DIMM Memory Channel Storage Owner (DDR3 Flash DIMMs)Flash Technology Project Owner and Subject Matter Expert – SanDisk Fusion IO, Intel NVMe Storage Products, Diablo Technologies- Support Engineering teams and communicate with supplier for joint efforts in defect resolution in both development and production- Manage Supplier relationship with Lenovo- Communicate requirements for new product qualification- Facilitate communication between Product Assurance, Marketing, and Development with Supplier(s)- Review product roadmaps and provide technical insight for marketing planning

Morrisville, Nc, Us

Design lead for NeXtScale HPC Direct Water Cooled Architecture (nx360 M5 WCT) - Developed 2nd Gen Node Level Water Cooling System for improving per-node performance and reducing total BOM cost compared with Gen 1 Product- Developed 2nd Gen manifold system for flexible configurations to meet a broader customer requirement- Integrated with Taiwan Development Team to develop Common Building Block NeXtScale Chassis for Air and Water Cooled Solutions (n1200 Chassis system)Design lead for IBM SuperMUC x86 Water Cooled Petascale HPC SystemDesign lead for Mech. Spec for Puresystem Compute Nodes (Flex Node x240, Flex Node x440)Design lead for Mechanical development of an IBM System x 3650M2 Server chassisCollaborated with Software Support team to deploy new CAD Management Software (PDM Link/Project Link)Core team member providing peer education for new CAD Management Software and CAD ToolsGenerated Mechanical models in 3D CADCollaborated with international suppliers and designers (China, Japan, Taiwan) including international travel for hard tool verification of new productsIntegrated processes for releasing product documentation with new and existing CAD management tools

Armonk, New York, Ny, Us

Design Team Lead for System x Intel Based Server development.

Upland, In, Us

- Led construction and assisted in design of new electronics lab- Maintained computer systems for the Department- Integrated new computer for laboratories

Upland, In, Us

- Designed and produced mechanical structure components for final prototype entered in Air Force competition- Generated AutoCAD drawings for documentation of final design- Researched, designed, and built Solar Array for satellite power system

Bachelors Of Science, Engineering Physics, Engineering Physics

Bs, Engineering Physics