周子安 Email & Phone Number

台灣 新北市

• Etch process: Operate different type od etch equipment (Lam, TEL, AMAT).• Fine tune etch parameter: To achieve ideal depth and uniformity.• Monitor in-line product : In-line, Defect, product distribute, lot handle.• Random issue analysis : SPC analysis, include Critical dimension out of spec, Defect high, In- line mismatch, yield improve.• Layer sponsor : Familiar with container and Back-end process• Project improvement : Defect high, Container CD issue

台灣 桃園市 龜山區

• Quality control of process. (Take charge for pHEMT, Regrowth wafer) • In-line monitor. (PCM, WAT, daily hold lot issue) • Data analysis. (SPC, Control Trend Chart, Excel, EDA) • Trouble shooting & Bank-in control. • Notify epitaxy supplier for action & prevention. • Electrical measurement: IV curve, Transfer curve