Lucix Corporation is a world leader of space communications payload electronics supplying RF communication equipment to customers including Astrium, Boeing, Lockheed Martin, Loral, MDA, and Orbital Sciences. The company has approximately 200 employees across two locations in Southern California: corporate office and factory in Camarillo, mechanical design center in El Segundo. In 2013, Lucix became an independently operated subsidiary of Heico Corporation (NYSE: HEI). Product Design LeadResponsible for the conceptualization, design, and documentation of a wide range of high-mix low-volume space-qualified RF products including LNA’s, downconverter and upconverter modules, and receivers operating at frequencies between 2GHz to 30GHz, S Band to Ka Band. Select Accomplishments:• 4+ years of experience in high frequency RF product development for the satellite industry.• Advanced knowledge of military specifications, clean room protocols, and space-qualified design and manufacturing methods.• Extensive knowledge of SolidWorks, AutoCad, and data/process control tools.• Drove mechanical and process standards to reduce cost, improve time to market, and commonize product development across multiple design centers.• Created and maintained design and documentation standards to improve team efficiency and overall quality of work.• Proposed and prototyped multiple design innovations for integration into standard product lines. Emphasis on lower cost, reduced weight, simpler assembly and testability.

NASDAQ: PWAVPowerwave was a global leader in end-to-end wireless coverage and capacity solutions forcommercial and military wireless communications networks. At its peak in 2010, the company had over 2100 employees across 18 locations located in 14 countries with annual revenues approximating $900M. Responsible for the conceptualization, analysis, design, and documentation of a wide range of volume production products including PA modules, feed-forward MCPAs, subracks, cavity filters/duplexers, base station amplifier systems, indoor racks, outdoor enclosures, repeaters, radioheads, antennas, and advanced radio designs between frequencies of 700MHz to 2.6GHz and for protocols including CDMA, GSM, UMTS, W-CDMA, and WiMAX.Select Accomplishments:12 years of experience in electronics packaging design, thermal and structural analysis, thermal, vibration, and IP testing, and overall product development for the telecom industry.Advanced knowledge of manufacturing methods including punching, stamping, turning, milling, extruding, pultruding, casting, injection molding, and rapid prototyping (SLA, SLS, and 3DP).Extensive knowledge of SolidWorks, Flotherm, and data/process control.Drove mechanical standards to reduce cost, improve time to market, and commonize product development across multiple global design centers.Drove thermal design standards to optimize analysis techniques across multiple global design centers.Developed analytical tools to automate quick first-order thermal analysis of basic and complex thermal systems.Developed an innovative PCBA process to cost-reduce and optimize the design of high power printed circuit cards. This process is now a company-wide standard design technique.Worked on multiple highly successful R&D programs to develop leading edge technologies for the telecom industry.Managed small global teams of junior engineers as a lead and mentor.

Litton Guidance and Controls division was purchased by Northrop Grumman (NYSE: NOC) in 2001. They are a leading worldwide producer of inertial navigation systems for military applications. Responsible for the design, analysis, prototyping, and testing of various mechanic components in military grade accelerometers and gyroscopes including hinges, bearings, fiber optic supports, and electromagnetic shields. Used finite element, analytical, and experimental methods in the design and evaluation of various components.Select Accomplishments:4 years of experience working on an R&D program to develop a new Litton-patented sensor technology.Used SDRC-Ideas and ProE to design and analyze various mechanical sensor components.Analysis includes multi-mode steady-state and transient thermal analysis, thermal expansion, structural analysis, modal analysis, and dynamic response with sinusoidal, random, and shock inputs.Worked on a MEMS team to develop a new low-cost silicon gyro suspension design.Worked on several cost reduction teams to improve existing Litton sensor designs.Regularly interfaced and presented data to high-ranking representatives from the Navy and the DOD.Named on two US patents: an etched silicon gyro suspension (US Patent #6,575,032) and a self-aligning high-stiffness gyro magnetic shield (US Patent #7,177,028).DOD Secret clearance.