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Devin Clark Email & Phone Number

Packaging Engineer III - Global Packaging Lab Lead at Teleflex
Location: Raleigh-Durham-Chapel Hill Area, United States 7 work roles 2 schools
1 work email found @teleflex.com 3 phones found area 803 LinkedIn matched
✓ Verified Jul 2026 4 data sources Profile completeness 100%

Contact Signals · 1 work email · 3 phones

Work email d****@teleflex.com
Direct phone (803) ***-****
LinkedIn Profile matched
3 free lookups remaining · No credit card
Current company
Role
Packaging Engineer III - Global Packaging Lab Lead
Location
Raleigh-Durham-Chapel Hill Area, United States
Company size

Who is Devin Clark? Overview

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Quick answer

Devin Clark is listed as Packaging Engineer III - Global Packaging Lab Lead at Teleflex, a with 9431 employees, based in Raleigh-Durham-Chapel Hill Area, United States. AeroLeads shows a work email signal at teleflex.com, phone signal with area code 803, and a matched LinkedIn profile for Devin Clark.

Devin Clark previously worked as Packaging Development Engineer at Teleflex and Global Packaging Engineer at Lenovo. Devin Clark holds Bachelor'S Degree, Packaging Science from Clemson University.

Company email context

Email format at Teleflex

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{first}.{last}@teleflex.com
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AeroLeads found 1 current-domain work email signal for Devin Clark. Compare company email patterns before reaching out.

Profile bio

About Devin Clark

Packaging Science graduate from Clemson University. Emphasis on packaging and structural design. Experienced in corrugated packaging design, project management, and package testing in the corrugated packaging, manufacturing, and technology sectors.Currently employed as a Packaging Development Engineer within Global Packaging for Teleflex primarily working on sustaining engineering and new product development projects for the Anesthesia and Emergency Medicine business unit. My scope of work formerly included packaging remediation, testing, and documentation related to European Union Medical Device Regulation (EU MDR).Previously employed as a Global Packaging Engineer with Lenovo US in the Data Center Group - Supply Chain Engineering. My responsibilities include packaging design and testing for new product introduction, product fragility testing of high-value servers, international supplier quality management, and packaging BOM structuring. End-to-end packaging engineering and packaging development for 2U servers, networking and switches, memory, and all applicable options and FRUs. I was also previously employed with Honda Power Equipment Manufacturing where I was working to improve the efficiency of supplier packaging, distribution, and in-house parts delivery and analyze the upstream and downstream effects of improvements.While employed with Packaging Corporation of America and Coastal Corrugated, I worked directly with customers to design and test cost-effective retail and distribution packaging and point-of-purchase displays.Experience with:Impact CADArtios CADTOPSCape PackSupplier Quality Engineering/Management/AuditISTA TestingLansmont Testing EquipmentProject ManagementCustomer/Supplier RelationsKongsberg/ZUNDMicrosoft OfficeAdobe IllustratorSolidWorks

Listed skills include Microsoft Office, Cape Pack, Solidworks, Project Management, and 9 others.

Current workplace

Devin Clark's current company

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Teleflex
Teleflex
Packaging Engineer III - Global Packaging Lab Lead
Chapel Hill, NC, US
Website
Employees
9431
AeroLeads page
7 roles

Devin Clark work experience

A career timeline built from the work history available for this profile.

Packaging Engineer Iii - Global Packaging Lab Lead

Chapel Hill, Nc, Us

Packaging Development Engineer

Wayne, Pa, Us

Global Packaging Engineer

Morrisville, Nc, Us

Jun 2018 - Jul 2019

Packaging Engineer

Bolingbrook, Il, Us

Investigation into expendable vs. returnable feasibility based on budget, production schedule, and logistics/transportation constraintsDesign and implementation of cost-effective returnable packaging for A-ranked production partsProject work focusing on packaging changes to improve picking process, production part flow, and lineside deliveryFocus on supplier conformation to production lot sizes in efforts to reduce material costs, freight costs, in-house handling costs, and residual parts wasteImprovement of supplier packaging to eliminate corrugate or reduce material usage while increasing part density in an effort to support "Green Factory" initiative

Feb 2016 - Apr 2017

Packaging Science Student

Clemson, Sc, Us

Coursework related to food processing and packaging, sterile packaging, polymers and material processing, package testing and ISTA testing procedures, protective packaging, distribution and environmental hazards, packaging laws, machinery, and manufacturing.Academic Projects:Cross-functional work with Food Science students to brand and package a newly developed food productAnalysis of packaging and shipping methods used to safely transport sensitive and expensive hip replacement systems to end userStructural design, branding, and graphic design for men's line of luxury facial care productsStructural and graphic design of unique paperboard carrier for 12oz bottles using ArtiosCADContract work and collaboration with industrial product company to verify packaging and distribution procedures are ideal and offer improvements.

May 2011 - Dec 2015

Structural Design Intern

Lake Forest, Illinois, Us

Numerous structural design projects relating to primary/secondary packages for consumer productsDesigned and assisted in designing numerous point-of-purchase displays for consumer product companies (e.g. weekenders, inside-out shippers, pallet/half pallet displays, power wings, countertop displays, archways)Acted as point of contact for many Fortune 500 companies while involved in project managementAdapted and executed ISTA test plans to ensure package systems were cost-effective while preventing what customers specified as “package failure”Redesign of unstable pallet pack and configuration used to ship king size mattresses in order to lower costs and improve safety

Jan 2015 - Jul 2015
Team & coworkers

Colleagues at Teleflex

Other employees you can reach at teleflex.com. View company contacts for 9431 employees →

2 education records

Devin Clark education

Bachelor'S Degree, Packaging Science

Clemson University

High School

Chapin High School
FAQ

Frequently asked questions about Devin Clark

Quick answers generated from the profile data available on this page.

What company does Devin Clark work for?

Devin Clark works for Teleflex.

What is Devin Clark's role at Teleflex?

Devin Clark is listed as Packaging Engineer III - Global Packaging Lab Lead at Teleflex.

What is Devin Clark's email address?

AeroLeads has found 1 work email signal at @teleflex.com for Devin Clark at Teleflex.

What is Devin Clark's phone number?

AeroLeads has found 3 phone signal(s) with area code 803 for Devin Clark at Teleflex.

Where is Devin Clark based?

Devin Clark is based in Raleigh-Durham-Chapel Hill Area, United States while working with Teleflex.

What companies has Devin Clark worked for?

Devin Clark has worked for Teleflex, Lenovo, Coastal Corrugated, Inc., Honda Power Equipment, and Clemson University.

Who are Devin Clark's colleagues at Teleflex?

Devin Clark's colleagues at Teleflex include Retno Widyaningrum, Nasruddin Hashim, Pallavi Sethi, Niklas Femers, and Iris Valdivia.

How can I contact Devin Clark?

You can use AeroLeads to view verified contact signals for Devin Clark at Teleflex, including work email, phone, and LinkedIn data when available.

What schools did Devin Clark attend?

Devin Clark holds Bachelor'S Degree, Packaging Science from Clemson University.

What skills is Devin Clark known for?

Devin Clark is listed with skills including Microsoft Office, Cape Pack, Solidworks, Project Management, Structural Design, Zund, Consumer Package Goods, and Package Testing.

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