Embedded programming and opto-electronic system simulation / design for semiconductor tool / process control.Design / automation of LED test bench around Ocean FX spectrometer.Embedded programming (QNX, C, C++) of optical process control sensor (ash tool).

Development of proprietary in-situ instrumentation dedicated to MOCVD process control - IR and blue pyrometer ; MO gas concentration / flow meter - sometimes in collaboration with vendorsMOCVD (Aixtron ; Veeco) system control - PLC programming ;Data analysis of R&D / production characterization data ;Data analysis of sensor / system process data ;Data analysis of LED performance data (Vf ; lm ; lm/W ; lm/$) ;Elaborate technical presentations for management, engineering and production teams ;Statistical summaries for executive, marketing, business strategy, teams ;Advanced technical and product strategy discussions ;Problem solver and troubleshooter both at system level / end-product (LED) level.Technical management of R+D lab (LED Device Architecture)

SEM sign off (FEI NanoSEM 450) and its metrology extensions: CL (Gatan), EDX (Edax).Setup and managed daily operations of the advanced SEM metrology lab.Designed and deployed an in-house EBIC setup.Designed biasing system for DUT (n-LED), for the study (CL) of piezo-electric fields (stress in crystal).Deployed EL/LIV metrology for production flow statistics.Supported PL metrology (Nanometrics’ Vertex).Executed critical measurements, such as “density of pit defects”; SEM tomography; biased CL spectroscopy; EDX analysis.

In-Situ Instrumentation (IR Temperature; Curvature; bowing; film thickness) and Bench Metrology (Photo Luminescence ; Optical Interferometry, Reflectometry, Emission) projects within the Solid State Lighting group.Improved the matching capabilities of in-line PL metrology, within and between metrology labs.Evaluated in-situ optical sensor, integrating in one sensor: Interferometry, Pyrometry, and Bowing measurements.

Chamber Matching DiagnosticsWafer Based Metrology / Wafer SensorsOES / OEIPCA-PLS analysis / SPCEvaluated alternate/disruptive sensory technologies, aimed at Chamber Diagnosis/Tuning/Matching.Evaluated On-Wafer Instrumentation (SensArray Corp.) for Temperature and RF.Evaluated OERS (Optical Emission Radio Spectroscopy), for monitoring of multi-frequencies excitation (Inductively/Capacitively Coupled) Plasma.Data fusion and analysis for in-situ/embedded tool sensors.Wrote diagnostics recipe aimed at health check / matching of process chambers / tools.

Design (Hardware, Software, Algorithms) for in-situ opto-electronic / RF sensors for Etch / PECVD process control; SECS communications;Developed advanced control AI algorithms for Optical Emission Spectroscopy / plasma diagnostics.Tested / evaluated / debugged / proposed enhancements in GUI of the AI engine.Developed / created training material -and trained- end-users on use of AI engine.Supported / Captured customers for critical / new process control (Etch, Chamber cleaning).Deployed a RF Vector Network Analyzer (HP4395A VNA), and automated its control / data acquisition with HP VEE® (a graphical programming environment, similar to LabView®) to collect / evaluate data from an original RF sensor, for etch process control.Participated to the development and tune up of a Neural Network pattern recognition algorithm, for time series.Designed (Hardware, Firmware, Optics) an original, robust, low cost opto-electronics sensor for CVD chambers.Developed SECS (SEMI Equipment Communication Standard E4 & E5) routines (C51, C86, ASM, C++).

Designed OES/OEI sensors for etch process control;Application Support across Europe and USA;Designed some sensory sub-components / communication routines for RGA; Ellipsometry; Langmuir Probe.In-situ, interferometric end-point, plasma monitor, MEMS, OES, trench.8051; 80186; ASM/PLM/C/ADA6502/65016 (Apple) ASMADC/DSP/DAC 16-18-22 bits.Proposed / developed / deployed, in a shoe-string budget and aggressive schedule, an hybrid (ADC–DSP–DAC) board to implement a high-Q notch filter, to extract weak endpoint signal in a strong modulated signal (rotating magnetic field) process chamber.Designed (HW, SW, and Optics) of advanced semiconductor (Etch / Deposition) process instrumentation; UV & VIS interferometer; Optical Emission Interferometry algorithms.Worked at various levels on the design, and support, of a multi-task (ADA) software platform fusing multiple sensor signals: OES, OEI, ellipsometer, Langmuir probe, RF-bias.Developed communication sub-systems (SECS; proprietary).Developed analog acquisition modules (ADC, DAC, MUX, µC, and DIO) for Apple IIe® and IBM PC®.Participated to the design of hardware for an RF compensated Langmuir probe.Analyzed & developed SPC algorithms for Preventive Maintenance, GO/NO GO signal.Design (H/W, S/W and algorithms) / support Close Loop process control (Deep Trench) to alter gas flows to balance etch / deposition mechanisms, from the Real Time output of OEI (Optical Emission Interferometry) signals, measuring simultaneously deposition thickness and trench depth.