#DFM/DFA reviews #New Product Introduction #Project Management #Continous Improvement #Failure analysis #jig,fixture & stencil development #Scrap reduction #New Machine Qualifications #Line Balancing #Time study#EMS support

#NPI process Qualifications #NPI Build Support #NPI to mass Production #Project Management #DFA reviews #Continuous improvement#Kaizen initiatives # Failure Analysis for SMT and Assembly #Assigning R&R for Technicians ,Junior Engineers and Engineers

#Failure Analysis in #SMT,#ORT ,RRT and #OQC ,#SMT line Qualifications ,#GR&R and #CPK studies for Machine and Process,#Strain Gauge verification ,#Continuous improvements,Kaizen,#Engineering Build Qualification.#FATP Process, #Yield Improvements,#8D,#FMEA ,#Control Plan,#SOP ,#RCCA,#7QC Tools.Familiar with various failure analysis techniques such as #Cross Section analysis ,#SEM,#EDX,X-ray ,VHX,#Die and pry test .Project Handled : Apple products

#DFM/DFA analysis#NPI support #Supplier Quality,#supplier on-site auditing ,#Defining Manufacturing Process ,#Supplier development #verifying and evaluating SMT and THT processes,#Supplier part qualification ,#SOP preparation ,#DOE,8D,FMEA preparation ,#7QC tools,#SCAR,#Supplier Evaluation ,#supplier development,#Supplier selectionProject : Energy Meters

Working as SMT Process engineer.Key responsibilities are,#Failure Analysis in SMT & THT, #Continuous improvements, #Yield improvements, #Scrap reduction, #Downtime reduction, #Cycle time optimization, #Solder Paste Printing,#Pick and place ,#Wave & Reflow soldering Related problem solving,#SPI programming,#Jig and fixture qualification and verification,#Stencil qualification and verification,#Thermal profiling(KIC Profiler),#Process Capability Analysis(Cp-Cpk) For Process and machines,#Poke-Yo-Ke and kaizen initiative,#Team management and Leadership,#Shift lead,#NPI Support,#DFM studies and analysis #FMEA,#SOP & Control plan preparation,#8D,#RCCAFamilar Machines,#Screen Printing: #DEK Neo Horizon#SPI:#Khoyoung 8030-2#Pick N place :#ASM SIPLACE#Refow:J#T,#Heller#X-ray:#DAGE,#NikonWave soldering :#JTProject : Apple Products , Reliance Jio ,Moto

Worked as SMT & TH Quality/Process EngineerProcess Quality & Supplier Quality Activities Key responsibilities was ,#Perform defect and failure analysis for Through Hole Technology & Surface Mount Technology (SMT)#8D,CAPA#FMEA ,CP ,Document preparation #IPCA610 F,#IPCWHMA620B#Reflow & Wave Thermal profiling for NPI &Mass Production(ECD Profiler(Super M.O.L.E.® Gold )#Continuous improvement .#New jigs & fixtures qualification, revalidation, preventive maintenance.#Audit preparation, NPI line support and DFM analysis#Developing SOP, Check sheets, process manual & Quality system procedure and ensure they are followed.#Developing and Implementing Error proofing (poke-yoke) on critical operations.#Scrap Monitoring ,reduction and control#Carried out internal quality system audit, manufacturing process audit.#AOI programming and verification#ESD audit#Analyzing quality issues related to customer complaints (8D).#Root cause analysis by 7QC tools#automotive ,#medical ,#aerospace products #PCBA,#Cable and wire harness,#final assembly ,#final integration ,#testing #NPI Project : Stanley Black and Decker,GE healthcare,Alstom ,Rafael ,Thales ….etc