As an R&D Process Development Engineer at AT&S, I work on innovative projects related to IC substrates, such as FOPLP, heterogeneous integration, 2.5 D packaging, TGV, component embedding, and co-packaged optics. I apply my expertise in laser micromachining, precision machining, photonics, optics, and laser science to create high-quality and reliable products for the semiconductor industry.Before joining AT&S, I was a Postdoctoral Researcher at the Vienna University of Technology and the Indian Institute of Science, where I conducted cutting-edge research on laser and conventional precision machining of materials, such as metals, composites, and laminates. I developed novel techniques for femtosecond laser surface functionalization, superhydrophobicity and superhydrophilicity, corrosion resistance improvement, surface chemistry analysis, and thermal stability of superhydrophobic surfaces. I also worked on several industry-funded projects, such as Boeing and Pratt & Whitney, and collaborated with FFG and Buhler Group. I have published multiple papers in prestigious journals, such as Applied Surface Science, Journal of Manufacturing Processes, and Optics and Laser Technology.I have a strong background in mechanical analysis, polymer composites, material characterization, wear and friction, cryogenic and unconventional machining, and NDT techniques. I hold a Six Sigma Yellow Belt certification and a Ph.D. in Machining of Fiber Reinforced Polymer Composite Laminates from the Indian Institute of Technology (Indian School of Mines), Dhanbad. I am passionate about advancing the field of laser and precision machining and creating innovative solutions for the challenges of the modern world.