Dian Fu (Daniel) Chen Email & Phone Number

新竹

1. Build up competency of DSC R&D Taiwan team which is the first full function R&D department in SUSS TW established in 2022. Design training plan for career path development of team member. 2. Executing annual assigned/dynamic task by leading R&D team with function of ME/EE/Optic/TE, team size 11 people.3. Continuously evolving way of work among cross discipline stakeholders to comply with company road map of company expansion.4. As a main stakeholder in Taiwan of cross site… Show more 1. Build up competency of DSC R&D Taiwan team which is the first full function R&D department in SUSS TW established in 2022. Design training plan for career path development of team member. 2. Executing annual assigned/dynamic task by leading R&D team with function of ME/EE/Optic/TE, team size 11 people.3. Continuously evolving way of work among cross discipline stakeholders to comply with company road map of company expansion.4. As a main stakeholder in Taiwan of cross site development project, including schedule planning and resource arrangement. Show less

台灣 Taiwan 新竹市

1. Technical linkage during production/R&D transfer phase between TW & USA for DSC lithography scanner.2. Provide technical support for issues from CS, production line.3. As a key user and coordinator to transfer way of work for CAD/PDM/ERP system from USA to Taiwan site.4. Create plans and innovation of designs for CIP and projects for next generation development.5. Main planner of cost reduction strategy for localizing product transferred back to Taiwan.

台灣 Taichung City 臺中市

1. Product leader of grinder (PCB/ IC substrate/ IC packaging industry.)2. Function enhancement of grinder. - High warpage handling for panel level product. - Improve TTV from 10 um to 5 um for 510x510 mm panel level substrate.3. Project management - Order BOM arrangement > Assembling > Integration > SAT.4. Customize test plan according to demand of new process proposed by customer.5. Work closely with sales team as technical interface for customer for… Show more 1. Product leader of grinder (PCB/ IC substrate/ IC packaging industry.)2. Function enhancement of grinder. - High warpage handling for panel level product. - Improve TTV from 10 um to 5 um for 510x510 mm panel level substrate.3. Project management - Order BOM arrangement > Assembling > Integration > SAT.4. Customize test plan according to demand of new process proposed by customer.5. Work closely with sales team as technical interface for customer for equipment spec. & ATP. Interpret customer demand into machine system design. Show less

台灣 臺中市

1. Project lead of mechanical design of grinder process equipment. - 2 dual unit system. - 2 quadra unit system.2. Optimize machine reliability - Moisture and dust elimination for metrology gauge. Extend life span from below 6 m to above 12 m. - Life span for linear motion component. Extend life span from below 1y to above 2y.3. Develop fly cut process equipment, for TTV <3 um Fan out application.4. OEM/ODM quality control - Define spec. & ATP of… Show more 1. Project lead of mechanical design of grinder process equipment. - 2 dual unit system. - 2 quadra unit system.2. Optimize machine reliability - Moisture and dust elimination for metrology gauge. Extend life span from below 6 m to above 12 m. - Life span for linear motion component. Extend life span from below 1y to above 2y.3. Develop fly cut process equipment, for TTV <3 um Fan out application.4. OEM/ODM quality control - Define spec. & ATP of OEM/ODM module and component.5. Cost reduction planning for Grinder product - 10% reduction in material is achieved Show less

台灣 臺中市

1. Mechatronic and automation design according to project demand.2. BOM managing for project. Identify LLT material to reduce impact of project schedule.3. Work closely with project manager and procurement to address demand in proper time.4. Responsible for field upgrade, CIP planning and design. (26 unit, 2 generation in field.)

新竹

Master'S Degree, Mechanical Engineering

Bachelor'S Degree, Mechanical Engineering