Diedevices.com is a design support + fulfillment resource dedicated to creators of System in Packages (SiP), Multiple-Chip-Modules(MCM), Multiple-Chip-Packages(MCP) and Hybrid Circuit applications.Our Mission Statement:To provide a working environment for electronic engineers to select suitable bare die components for their designs. Both electrical performance & commercial availabilityTo provide engineers responsive technical support at design and component selection stagesTo provide a reliable high quality source of bare die supply from first prototypes, tape-outs and into volume productionTo provide an on-going point of technical support throughout the program life and effectively deploy our die processing resources as needed.To provide creative technical solutions in the event of component obsolescence or via management of long term programs.To partner with like-minded semiconductor companies focused on the customer and with a commitment to supporting the bare die format. Our Goals:Achieve a level of standardization across what is perceived as a niche non-standard productHelp engineers use die to innovate and develop products with a competitive market edge Empower and support growth in use of the bare die format globally and across all industriesPromote increased integration of products at a modular or system level by going to die level. Our Core Values:Quality comes firstCustomers are our focusOur people are our strengthContinuous improvement and creative innovationPartners with a similar mindset.