+ Base on analyzing “Marketing Requirements Documents”, define and propose new Android product solution as: HW configuration, SW function..+ Coordinate with HW/SW and Mechanical engineers to make detail product configuration+ Coordinate with OEM/ODM component suppliers, manufacturers, factories … to make project plan, estimate cost..+ Manage product manufacturing processes, performance, quality+ Build testing/Verifying processes for protoype and production+… Show more + Base on analyzing “Marketing Requirements Documents”, define and propose new Android product solution as: HW configuration, SW function..+ Coordinate with HW/SW and Mechanical engineers to make detail product configuration+ Coordinate with OEM/ODM component suppliers, manufacturers, factories … to make project plan, estimate cost..+ Manage product manufacturing processes, performance, quality+ Build testing/Verifying processes for protoype and production+ Responsible for coordinating resources according to priorities established by management team+ Project : Android boxes, tablets for Smart Karaoke, Entertainment system Show less

Smartphone HW Design

+ Presentation, block diagram, project plans, Specification,Datasheet,Hardware documents..+ Schematic Circuit and PCB Layout design for embedded/server and telecom systems+ Simulate SI/PI/Thermal to verify board/placement/signal routing… meet timing/logic level/ power(voltage,current…) and thermal requirement – using Hyperlynx-Mentor Graphic tool+ Lab measurement/testing/bring up Validation/Reference boards/product prototypes by using Tektronix,Agilent oscillioscopes+… Show more + Presentation, block diagram, project plans, Specification,Datasheet,Hardware documents..+ Schematic Circuit and PCB Layout design for embedded/server and telecom systems+ Simulate SI/PI/Thermal to verify board/placement/signal routing… meet timing/logic level/ power(voltage,current…) and thermal requirement – using Hyperlynx-Mentor Graphic tool+ Lab measurement/testing/bring up Validation/Reference boards/product prototypes by using Tektronix,Agilent oscillioscopes+ Ball map, package design/review for new chips+ Study new interfaces, technology Show less

+ Experience in manage/design PCB layout with Cadence Allegro tool: . PCB footprint : create BGA,TSOP,SOIC, SMD/Through hole Connector....PCB footprint library base on mechanical drawing on datasheets . Floorplan and Placements components: make floorplan/placement for power distribution, critical hi-speed components, analog circuit.... . Define Stack-up : define multi-layer stack-up, thickness, materials, number of layer.......... . Routing, Matching length :… Show more + Experience in manage/design PCB layout with Cadence Allegro tool: . PCB footprint : create BGA,TSOP,SOIC, SMD/Through hole Connector....PCB footprint library base on mechanical drawing on datasheets . Floorplan and Placements components: make floorplan/placement for power distribution, critical hi-speed components, analog circuit.... . Define Stack-up : define multi-layer stack-up, thickness, materials, number of layer.......... . Routing, Matching length : Route hi-speed signals as XFI, XAUI,PCIe,SATA3,USB3,DDRx..... . QA and Gerber data for fabrication Show less

+ Experience in manage/design PCB layout with Cadence Allegro tool: . PCB footprint : create BGA,TSOP,SOIC, SMD/Through hole Connector....PCB footprint library base on mechanical drawing on datasheets . Floorplan and Placements components: make floorplan/placement for power distribution, critical hi-speed components, analog circuit.... . Define Stack-up : define multi-layer stack-up, thickness, materials, number of layer.......... . Routing, Matching length :… Show more + Experience in manage/design PCB layout with Cadence Allegro tool: . PCB footprint : create BGA,TSOP,SOIC, SMD/Through hole Connector....PCB footprint library base on mechanical drawing on datasheets . Floorplan and Placements components: make floorplan/placement for power distribution, critical hi-speed components, analog circuit.... . Define Stack-up : define multi-layer stack-up, thickness, materials, number of layer.......... . Routing, Matching length : Route hi-speed signals as XFI, XAUI,PCIe,SATA3,USB3,DDRx..... . QA and Gerber data for fabrication+ Design many High speed PCB layouts for customers such as Cisco, DELL, HP, etc… Show less