Principal Process Integration Engineer
CurrentProcess integration (films, etch, photo, CMP, Bonding etc) to improve/sustain GaAs based different microLED device architectures to achieve best achievable WPE, Vf, LEE, reliability etc.Understanding the fundamental aspects of a device performance, limitations and failures from process point of views. Maintaining PCP, SPC; taking active parts in 8Ds, FMEA, and establishing new BKMs, simplifying process integration to reduce cycle time for faster learning cycles.