I am a talented, hard-working, energetic, and fast learning semiconductor materials process engineer work and maintain a multi-chamber Molecular Beam Epitaxy (MBE), utilize broad knowledge of semiconductor wafer processing equipment and processing procedures such as wet and dry etching, metals evaporation and depositions, lithography processing (optical and e-beam), interface and surface characterization on semiconductors. I would like work and learn more and looking for a position where my skills and contribution will be applied.Technical Skills:• More than four years of hands on working experience on operating and maintaining MBE.• Huge talents and experience in lithographic mask development, photolithography, and e-beam lithography.• More than ten years of experience on wet and dry (RIE) etching, metal evaporation (In, Ti, Pd, Au), metal deposition (W, Moly, Ni, Ti), sputtering (Ti, SiO2), annealing and wedge bonding.• Hands on skills and expertise in surface characterization using Scanning electron microscopy (SEM) and atomic force microscopy (AFM) imaging and step-height characterization using SEM and profilometer.• More than ten years of university clean room working experience in semiconductor device processing techniques.• Hands on semiconductor structural characterization using x-ray diffractometer (XRD) and energy dispersive X-ray (EDS) techniques.• Hands on skills on defect characterization using Olympus FluoView™ FV1000 (ConFocal, C-Pl).• Expert on electronic and spin property characterization using a cryogenic Hall system.• Hands on skills wafer polishing and wet etching techniques (CdTe, PbTe and InSb).• Hard working ability and fast learner of new semiconductor technology.
