• Responsible for strategic and tactical marketing tasks related to trans-capacitive fingerprint sensor devices for both personal computer and mobile handset markets. These tasks include generation of MRD (marketing requirements documents) for sensors that meet the needs of these end solution markets. • Defined datasheets, product briefs and "go to market" strategies for these fingerprint sensors. • Scheduled and managed customer specific "road shows" for these sensors. Engaged multiple tier one OEM accounts including Huawei, OPPO, vivo, Lenovo, Hewlett-Packard and DELL.• Directed UX “usability studies” for various biometric sensing technologies including fingerprint, 2D face and 3D face, iris, gesture or behavioral and palm recognition technologies.• Responsible for the development and launch of the “MultiMatch” multi-modal biometric solution for mobile handsets. Announced at the 2017 CES Trade show in Las Vegas, Nevada

EquipIC supply chain is a semiconductor IC supply chain service provider, we provide foundry, package and test services to fabless startup companies, system houses and IP developers. We specialize in advanced 130nm, 90nm and 65nm technology node access, and are able to leverage our vendor relationships to minimize supply chain solution costs for our customers.

Product line responsibilities for the Symwave BioPrint product line including strategic marketing, business development and product roadmap definition for the PC market and mobile handset markets. Directed engineering evaluation for the core adaptive capacitive sensor technology including electrical specification, resolution and sensitivity, ruggedness and reliability.

Responsible for product marketing and business development for Atrua's biometric fingerprint sensors for notebook PC security and embedded "stand alone" biometric security solutions. Promoted low cost USB solutions and established application software partnerships with SOFTEX and DIGITAL PERSONA. Defined embedded solutions with NXP and ATMEL ARM7 and ARM9 microprocessors.

Responsible for the transfer of Veridicom fingerprint biometric sensor IC and software technology to Fujitsu Microelectronics and the establishment of the biometric sensor product group.Responsible for all product line activities including P&L, sensor development, software development, hiring of marketing and engineering staff, and development of the capacitive based FP sensor product roadmap. Released the first capacitive based sweep sensor design ( MBF300 ) that was recognized in 2002 by Electronic Design MAgazine for the years most innovative product. Oversaw revenue growth to over $5M over a period of 3 years.

Responisbilities included foundry interface management for Samsung and UMC foundries for 0.50um adaptive capacitive based sensor technology. Developed ultra hard SiN/TiN capacitor structure for sense electrodes, patented through Veridicom. Directed IC design team for the development of the FPS200 sensor that included USB1.1 and 8bit flash ADC's and 2 stage pipeline ADC operating at 10MS/sec. Developed fab independent sensor design rules and design methodologies. Member of key personel transfer team to transfer Veridicom IP to Fujitsu Microelectronics and others.

Managed a staff of 6 process integration and device engineers for the development and integration of Qubic2 - an 0.5um single poly emitter BiCMOS technology with high speed NPN fT of 25GHz. Managed transfer of Qubic1 and Qubic2 process trchnology from PRLS Sunnyvale to Philips Fab 5 and Fab 6 in Albuquerque, New Mexico. Responsible for bipolar and CMOS device design and process integration. Directed device characterization and reliability studies including CMOS hot carrier lifetime and AlCu metal electromigration. Managed the release of the Qubic1 and Qubic2 process design manuals.