Doug Landry Email & Phone Number

Nashua, Nh, Us

Chandler, Az, Us

Chandler, Az, Us

London, Gb

Boston, Ma, Us

Help reshape rigid, conventional electronics into thin, flexible devices that can stretch, bend and twist seamlessly.Responsible for all aspects of chip on flex technology and wafer based flexible electronics.Create 6 inch prototypes using Harvard University and UMass Lowell clean rooms.Assist on technical assignments that are complex in nature where considerable judgment and initiative are required in resolving problems and making recommendations.Operate a variety of specialized Failure Analysis equipment.Perform a variety of specialized Failure Analysis techniques. Develop/master grinding and polishing skills.Work in cross-functional teams to improve overall performance of the company’s multiple platforms

Coordinate and perform all tasks Photolithography, Deposition, Etching wet and dry, Assembly, Dicing, Packaging.Provide all in-house Engineering fabrication 6 inch and 4 inch production at MIT and Boston University.Perform inspection on all MEMS foundry wafers that are delivered also in charge of their release into productionSupport of assay development MEMS process improvements and assist with process development.In charge of weekly micro BCA for antibody, surface chemistry DSP cleanings that directly affect product performance.Build all Proprietary workstations in-house and keep track of delivery goals and customer needs.Use various types of measurement tools hand tools and gauging devices for accurate results and completion of product.Follow diagrams and blue print designs SOPs to complete builds.Performed final testing on newly created equipment to meet engineering specs.Evaluate all process problems and improvements and report them to Management.

Provided process support and development input to R&D Engineering Teams on several key projects, including: MEMS, MOEMS, RF Switches, Bio MEM's, gas detectors, and injectors.Performed chemical processing (both wet and dry processes), Incoming Inspection, Qualitative Product Testing, and QA Inspection.Extensive experience with SEM, DRIE, XeF2 metal evaporation and full photolithography and chemical processing.Gained experience in polyimides, packaging processes, and anodic bonding experience of multiple material compositions being bonded to each other.Tools used in fab are as follows Denton sputter system, Dektak, Alcatel, MA6 ,MA150, tencor ,4 point probe, nanospec.

Processed materials through Gallium Arsenite Manufacturing, utilizing Temiscals and sputter system.Ensured product specifications were satisfied and completed material transactions when required.Held a position in the Silicon Etch Area, supporting all plasma and Wet Etch equipment.Utilized Wet Etch for oxides and metals, and Front-End resist strip operations in the Silicon Etch Area.

Performed chemical handling and production, including: Poly, Nitrides, Oxides, and OxyNitrides.

Certificate, Lean Six Sigma Green Belt

Education record

Certificate Courses

Precision Manufacturing