Oversees development and implementation of Aculon's sales strategy and business development to meet the surging demand for Aculon's nanoscale coatings and surface modification treatments, especially for the flipchip microprocessors, semiconductor leadframe treatments, smartphones, smart watches, IoT, healthcare sensors, and automotive/EV markets, in the USA and Asia (Korea, China, Taiwan, and Philippines).

Production services, IP licensing, and patent valuation consulting for US companies utilizing China-based manufacturing in chip assembly, final test, and module assembly, focused on multichip RF designs, flipchip, and IoT modules.

Provided executive sales and marketing leadership for this start-up company, for licensing technology and patents to tier-1 smartphone makers that require low-cost, thin film, lightweight electronics waterproofing based on CVD deposited multi-layer polymers. Establish new market verticals by demonstrating high value ROI new technology and equipment that customers can leverage to grow their market presence, share, revenue, and profit. Worked extensively in China and Korea.

Led semiconductor and electronics systems technology transfer, know-how, and patent licensing sales. Hybrid wafer bonding, DRAM chip assembly, wafer fab, and fine pitch flipchip processors technologies.

Sales of next gen technology transfer, know-how, and IP licenses in the microelectronics and semiconductor packaging market. Managed sales for smartphone, power switching, wireless RF, nanocoating RF shielding, LED, digital imaging software, digital cameras, embedded actives, processor markets, and HEV automotive. Patent licensing included.

Managed joint 3-way TI-supplier-customer teams to design next generation smartphones based on silicon integration, package-on-package (PoP) and feature/performance needs. Designed next gen modules for RF, power management, DRAM/NAND, and applications/baseband processors. Selected designs, processes and subcontractors for smartphone miniaturization and cost reduction. Managed new semiconductor packaging technology development for $4B wireless sales BU, including SOC chip design engineering teams, chipscale, wafer level fanout, flip chip, thin POP, tape BGA, embedded actives, multi-chip, passive integration; analog power management, applications processors, baseband processors, RF transceiver integration, DRAM and NAND flash stacking, and smart phone partitioning.

Managed operations, sales, and profit of this start-up company; semiconductor product development engineering services company; services included SOC digital wireless and mixed signal chip design, final AT test program development, prototype manufacturing, prototype packaging, FIB silicon level chip repair and modification.

Responsible for revenue growth all semiconductor device markets primarily digital wireless and RF chip assembly, packaging, and final test customer and market development; managed wireless chip and cell phone OEM market sales team.