Responsible for all aspects of Engineering Development (ME, PE, Test Engineering) -10 Manufacturing Engineers -8 Process Engineers -Facility Management Staff -7 Test Engineers (Including 2 Test Managers) Interfacing with Corporate Engineering Directors on overall Global Structure of Engineering Directives and initiatives to meet and stay current with demands of electronic assemblies, not limited to - Chip on Board, Underfill, 01005 processing, DOE Testing, etc. Labor Quoting Analysis/Approval for Customer Product (Material/Labor) content CAPEX Budgeting for all internal processing Equipment. Monthly KPI Reporting to Corporate – With improvement planning Responsible for Department Directives – Metrics, Priorities, Structure Key Customer contact for clarity of product, development & issue resolution DFT/DFM Coordination for Customer Development Logistics Development/Quality Control Development and Implementation Development of overall NPI Process across the factory disciplines Labor analysis for factory model development and implementation Responsible for OTD of customer products and understanding of manufacturing constraints

Responsible for the Quality of the Avionics Electronics Department. Hold CIT – Customer Improvement Team Meetings on a weekly basis to review any customer returns and Review process work instructions. Provide monthly CAB reporting to Senior Management on status of Electronics area. Perform all RRCA – Relentless Root Cause Analysis on process related customer returns. Monitor and Measure processes for CpK of 1.33 or greater. Perform PFMEA and DFMEA on new products and existing product issues. Interface with Service Center on all customer related issues.

Responsible for all Maintenance Processes, Equipment Selection, Maintenance TPM, Process Engineering staff, Product Engineers, Line Technicians, SMT Programmers and AOI Equipment Programmers. Daily Work Order Generation, Preventive Maintenance and Equipment Analysis.Setup Maintenance Training Schedule for Technical Staff as well as Production Coordination during machine down time. Development, document and ensure all required documentation is accurate to build product through the facility. Introduce new surface mount assembly (SMA) processes required to fulfill customer and internal quality standards including yield projections. Review all customer quality requirements as well as how this will be presented during manufacturing. Setup the work instructions for operations personnel to ensure all customer demands are met.Analyze defect data on a daily basis to find the root cause to increase FPY.Create Pareto charts on parametric data to determine which items were causing the most issues.Followed through on all 8D reports to satisfy customer concerns. Analyzed and reviewed failure data on the manufacturing floor to determine where improvements could be made.Oversee the creation of all SMT programs/databases used for production.Developed an under fill process for the celluar phone platform manufacturing.Setup studies to determine if the process was the problem and/or if there were individual differences.Developed an AOI Pre-Reflow process for analysis on all products as well as feedback for equipment calibrations.This created a 5% increase in FPY within the first 3 months of implementation.