Principal Electrical Engineer
Capcon Ltd. Singapore Branch
Singapore
Optimise motion control to cancel noise from weak mechanical module, optimise process of high accuracy chip bonder for face up/down, single/dual lane, small/big die pick & place application, achieve industry competitive UPH and accuracy.Design the dedicated dual gantry control model with advanced collision prediction feature for fixed and flexi beam. Design current-detection touch down algorithm for module planarity check.Machine integration and setup from module assembly to calibration, hands-on experience from sub-module to machine.