Global operation, key customer support on hybrid bonding machine setup and qualification.Continuous improvement on die attach machine and module test unit from assembly qualification to user experience.Investigation on key topic related to advanced packaging platform.

Global operation, customer support, continuous improvement and roadmap project in motion control area of advanced die attach platforms.

Optimise motion control to cancel noise from weak mechanical module, optimise process of high accuracy chip bonder for face up/down, single/dual lane, small/big die pick & place application, achieve industry competitive UPH and accuracy.Design the dedicated dual gantry control model with advanced collision prediction feature for fixed and flexi beam. Design current-detection touch down algorithm for module planarity check.Machine integration and setup from module assembly to calibration, hands-on experience from sub-module to machine.

Onsite support on the 1st POP machine in AmKor Korea.Design dual gantry motion control SIMULINK model for POP and Sorter machine with multi-bonehead and gantry collision detection and motor protection algorithm.Axis tuning for POP and Sorter machine.Setup Kollmorgen AKD test bench with MEI SynqNet controller.

Next-generation cellular network architecture C-RAN and key technology.Wideband CFR+DPD scheme for multi-mode and muilti-band RRU (Radio Remote Unit).

VDSL2 simulation, WiMAX CPE Project, HomePlug AV CPE project.

WiMAX CPE R&D

Multiuser detection, wireless network planning, smart antenna, wimax physical layer