Aeronautical Ground Systems design, packaging of EIA standard rack and panel assemblies for global defense systems. Broad engineering background with electro-mechanical hardware design, from initial concepts and prototype assembly through final production to release of successful products in the market place. Solid background in Pro Engineer 3D modeling using Top Down structuring. Ability to understand calculation and specification of dimensions, tolerances, form and position control through application of GD&T techniques. Excellent leadership, organizational and communication skills. Extremely thorough, detail oriented and hard working team member.

Design constraints and packaging of wireless device circuit card assemblies for test engineering and lab environments as well as innovative wireless device housing designs for consumer products.Broad engineering background with electro-mechanical hardware design, from initial concepts and prototype assembly through final production to release of successful products in the market place. Solid background in Pro Engineer 3D modeling using Top Down structuring. Ability to understand calculation and specification of dimensions, tolerances, form and position control through application of GD&T techniques. Excellent leadership, organizational and communication skills. Extremely thorough, detail oriented and hard working team member.

Precision model fabricator for telecommunications and government systems.