Donald Gardner

Donald Gardner Email and Phone Number

Materials Scientist & Electrical Engineer ▶ Energy Storage | Power Delivery | Passive Devices | IoT | IEEE Fellow @ SLAC National Accelerator Laboratory
Donald Gardner's Location
San Francisco Bay Area, United States, United States
Donald Gardner's Contact Details

Donald Gardner work email

Donald Gardner personal email

n/a
About Donald Gardner

Materials Scientist, Electrical Engineer, Physics, and Inventor. Donald is an IEEE Fellow and received his Ph.D. in Electrical Engineering from Stanford University. Patents and PublicationsDonald is the inventor of 135 issued U.S. patents and some pending/allowed patents including for high-frequency voltage converters, energy storage devices, electrochemical capacitors, inductors using magnetic materials, and copper and layered aluminum alloys metallurgy for interconnections. Donald has published 160+ electrical engineering and materials science papers in journals and conferences. Over 7,900 authors have cited his publications (h-index = 43).AwardsHe has received Intel’s highest technical award (IAA) “For Fundamentally Changing Platform Power Delivery with Integrated Voltage Regulators and Magnetic Inductors on CMOS” and an award for the "World's First Integrated Voltage Regulator". He has received five Best Paper and Poster awards at conferences and his inductor paper in IEEE IITC 2001 received the top score.AccomplishmentsDon conceived the idea of creating high-frequency integrated voltage regulators that were implemented by a team of circuit designers in Intel microprocessors resulting in longer battery lifetimes in laptops. In addition, Don developed integrated inductors with magnetic material that have the highest inductance density known. He conceived new electrochemical capacitors for energy storage for IoTs. He invented embedded MIM capacitors that are in Intel microprocessors. He also created reflowed copper interconnections and used it to fabricate the first working chip with copper, then published on interconnection size effects that is the first study that showed this to be an interconnect scaling issue. He invented Al alloy/Ti interconnections that were widely used by most microchip manufacturers.Email: don.gardner@alumni.stanford.edu

Donald Gardner's Current Company Details
SLAC National Accelerator Laboratory

Slac National Accelerator Laboratory

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Materials Scientist & Electrical Engineer ▶ Energy Storage | Power Delivery | Passive Devices | IoT | IEEE Fellow
Donald Gardner Work Experience Details
  • Slac National Accelerator Laboratory
    Research Scientist
    Slac National Accelerator Laboratory 2016 - Present
    Menlo Park, California, Us
    • Developing porous-silicon based x-ray diffraction gratings for imaging applications.
  • Stanford University
    Visiting Scholar
    Stanford University 2001 - Present
    Stanford, Ca, Us
    • Initiated and conducted research in SiGe quantum well structures for photonics that resulted in high-frequency optical modulators.• Collaborated and contributed to research in robust computing systems that led to two best paper awards.• Invented an aluminum alloy/titanium metallization for interconnections that was widely used in microchips in the microelectronics industry worldwide.• Pioneered the characterization of metallic films using mechanical stress measuring techniques in-situ during thermal cycling that are widely cited in the literature.
  • Intel Corporation
    Principal Engineer In Intel Labs And Server/Mobile Processor Development
    Intel Corporation 2001 - 2016
    Santa Clara, California, Us
    • Created and co-developed high-frequency voltage converters that are in current use in the latest Intel "Haswell" and "Broadwell" microprocessors. • Invented inductor structures using magnetic materials and MIM capacitor structures that met the needs of power delivery and RF circuit applications and resulted in the world's first fully integrated voltage regulator.• Conceived and developed porous-silicon based electrochemical capacitors for integrated energy storage.
  • Intel Corporation
    Research Engineer In Components Research
    Intel Corporation 1991 - 2001
    Santa Clara, California, Us
    • Invented embedded MIM capacitor structures used in Intel's third generation and fourth generation microprocessors.• Invented and developed a reflow copper deposition technology used to fabricate the world's first working chip with copper-based interconnections.
  • Hitachi
    Visiting Scientist
    Hitachi 1989 - 1991
    Chiyoda-Ku, Tokyo, Jp
    • Developed copper interconnection technology.• Achieved good proficiency in Japanese language and customs.

Donald Gardner Skills

Materials Science Electrical Engineering Nanotechnology Semiconductors Thin Films Silicon Electrochemistry Microelectronics Cmos Rf Electrochemical Capacitors Energy Storage Simulations Microprocessors Physics Embedded Systems Engineering Mems Nanofabrication Magnetics Process Integration Battery Technology Semiconductor Process Technology Silicon Anodes Afm Innovativeness Labview Radio Frequency Voltage Converters Power Delivery Inductors Interconnection Technology Copper Metallization Nanostructure Manufacturing Additive Manufacturing

Donald Gardner Education Details

  • Stanford University
    Stanford University
    Materials Science
  • Stanford University
    Stanford University
    Electrical Engineering
  • University Of Southern California
    University Of Southern California
    Electrical Engineering
  • University Of Southern California
    University Of Southern California
    Physics

Frequently Asked Questions about Donald Gardner

What company does Donald Gardner work for?

Donald Gardner works for Slac National Accelerator Laboratory

What is Donald Gardner's role at the current company?

Donald Gardner's current role is Materials Scientist & Electrical Engineer ▶ Energy Storage | Power Delivery | Passive Devices | IoT | IEEE Fellow.

What is Donald Gardner's email address?

Donald Gardner's email address is do****@****mni.org

What schools did Donald Gardner attend?

Donald Gardner attended Stanford University, Stanford University, University Of Southern California, University Of Southern California.

What are some of Donald Gardner's interests?

Donald Gardner has interest in Post Silicon Validation, Energy Storage, Power Delivery Circuits, Nanostructure Devices, Magnetic Materials And Inductors, Robust Computers, Quick Error Detection, Electrochemical Capacitors, Embedded Capacitor Structures.

What skills is Donald Gardner known for?

Donald Gardner has skills like Materials Science, Electrical Engineering, Nanotechnology, Semiconductors, Thin Films, Silicon, Electrochemistry, Microelectronics, Cmos, Rf, Electrochemical Capacitors, Energy Storage.

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