Doug Sparks Email & Phone Number

Fort Wayne, IN, US

M2N Technologies LLC- Visit our website at: https://m2ntechnologies.org/ - provides MEMS, semiconductor and sensor consulting and development services. Areas covered include fab selection and MEMS/Semi supply chain improvements & strategies, wafer bonding, MEMS hermetic packaging and process development, design and process integration, getter integration.

Sunnyvale, California, US

InchFab is offering the semiconductor and MEMS industry a new approach the foundry business. Leading business development & sales and bringing in new MEMS process modules and capabilities.

Houghton, MI, US

MANCEF- Micro and Nano Commercialization Educational Foundation- is a non-profit organization comprised of an international group of passionate technology commercialization evangelists who’s goal it is to accelerate the commercialization of emerging technology of all varieties. Doug is working to expand MANCEF across Asia. Doug was promoted to the.

Fushun, Liaoning, CN

Doug was part of Hanking Electronics, the MEMS products division at the Hanking Group. He has worked on the design and equipping of a new 200mm MEMS cleanroom facility in Fushun, China. He oversaw MEMS product and process development for pressure, temperature, flow, gas and strain sensors and RF resonators. He began the distribution of a Multi-User MEMS.

NanoGetters provided vacuum packaging services for improved hermetic sealing of MEMS devices like resonators, IR sensors, gyroscopes, pressure sensors and RF-MEMS. The company also provided related MEMS foundry services like wafer bonding, getter deposition and patterning on wafers and package lids, frit glass patterning, bonding and getter integration.

While at Integrated Sensing Systems Doug worked on micromachined products, (MEMS), Coriolis mass flow and density sensors, FDA approved drug Infusion products, wireless implantables and fuel cell methanol concentration and gas sensors. He managed system engineering and operations he also directed the flow product line, launched numerous microfludic-based.

Gillingham, United Kingdom, GB

At Delphi (GM's Delco) Doug worked on MEMS and IC development, design and manufacturing, silicon and steel pressure sensors, nickel electroformed gyroscopes, accelerometers, occupant detection, discrete and CMOS integrated sensors, wafer fab processing, automotive and aerospace sensor applications. He developed low temperature solder wafer bonding.