M2N Technologies LLC- Visit our website at: https://m2ntechnologies.org/ - provides MEMS, semiconductor and sensor consulting and development services. Areas covered include fab selection and MEMS/Semi supply chain improvements & strategies, wafer bonding, MEMS hermetic packaging and process development, design and process integration, getter integration and additive manufacturing. Micro to Nano Technologies develops new sensors like pressure, flow, optical sensors and resonators, MEMS and 3D printed-based products, AM sensors and AM wafers as well as provides technology, business and MEMS / Semiconductor consulting services and related legal services such as expert witness litigation, IP, acquisition due diligence- email: dsparks@m2ntechnologies.org

InchFab is offering the semiconductor and MEMS industry a new approach the foundry business. Leading business development & sales and bringing in new MEMS process modules and capabilities.

MANCEF- Micro and Nano Commercialization Educational Foundation- is a non-profit organization comprised of an international group of passionate technology commercialization evangelists who’s goal it is to accelerate the commercialization of emerging technology of all varieties. Doug is working to expand MANCEF across Asia. Doug was promoted to the Management Board in November, 2020 and the position of VP Asia-Pacific. Doug organized the first virtual and hybrid conferences for MANCEF in 2020 and 2021 and was a co-chair of the virtual COMSWORLD 2021 and China COMET 2021. Also a member of the Business and Industry Leadership Team (BILT) for the NSF-funded Micro Nano Technology Education Center (MNT-EC), the Semiconductor Alliance and the NSTC National Semiconductor Technology Center Semiconductor Supply Chain Task Force.

Doug was part of Hanking Electronics, the MEMS products division at the Hanking Group. He has worked on the design and equipping of a new 200mm MEMS cleanroom facility in Fushun, China. He oversaw MEMS product and process development for pressure, temperature, flow, gas and strain sensors and RF resonators. He began the distribution of a Multi-User MEMS Processes, Hanking MUMPS in China, and the start-up of Hanking's 200mm MEMS foundry. Doug also lead the acquisition of inertial MEMS business assets, including 3dof and 6dof IMUs, for Hanking. Hanking was named one of EE Times Si100 companies to watch in 2020.

NanoGetters provided vacuum packaging services for improved hermetic sealing of MEMS devices like resonators, IR sensors, gyroscopes, pressure sensors and RF-MEMS. The company also provided related MEMS foundry services like wafer bonding, getter deposition and patterning on wafers and package lids, frit glass patterning, bonding and getter integration strategies. NanoGetters worked with wafers, chip scale, ceramic and metal packages and was both ISO 9001-2008 certified and AS9102 qualified. NanoGetters was acquired by Materion.

While at Integrated Sensing Systems Doug worked on micromachined products, (MEMS), Coriolis mass flow and density sensors, FDA approved drug Infusion products, wireless implantables and fuel cell methanol concentration and gas sensors. He managed system engineering and operations he also directed the flow product line, launched numerous microfludic-based products, implemented fusion bond, frit bond, metal feedthrough and getter processes and MEMS design guidelines as well as epoxy, solder and anodic microfluidic chip attachment methods for high pressure liquid and gas applications while at Integrated Sensing Systems. The microfluidic sensor technology was licensed and manufacturing line acquired by Endress+Hauser.

At Delphi (GM's Delco) Doug worked on MEMS and IC development, design and manufacturing, silicon and steel pressure sensors, nickel electroformed gyroscopes, accelerometers, occupant detection, discrete and CMOS integrated sensors, wafer fab processing, automotive and aerospace sensor applications. He developed low temperature solder wafer bonding processes and a steel high pressure sensor design & fabrication process. Started up the epitaxy section of the new wafer fab.