Mechanical Engineering Architect and Management experience in the high-performance computing and aerospace industries. Extensive experience developing, specifying, and testing electronic packaging and enclosures for commercial, aerospace, airborne and ground-based military applications; ranging from portable hand-held systems to large data center systems; custom enclosures to meet commercial and rugged military specifications; cooling methodologies including forced-air, liquid conduction, various types of heat pipes, and liquid immersion technology. Experience packaging a wide range of micro-electronics circuit boards and interconnect, including FPGAs, high speed data, micro-coaxial, and fiber optics. Experience specifying power systems and related interconnect, including discrete point of load and distributed power. Proficient with SolidWorks 3D CAD, specializing in new product design and development, complex assembly design, photo-realistic product rendering, and finite element analysis for structural and thermal. Experience with multiple manufacturing technologies, including sheet metal, complex milling, casting, rapid prototyping, injection molding, and 3D additive manufacturing. Program and Project Management experience with commercial and government contracts, from proposal and statement of work, through product development, production, delivery, and support. Experience with all aspects of product qualification testing for Electromagnetic Emissions and Immunity (EMI/EMC), and environmental testing such as Altitude, Thermal, Shock and Vibration, and Safety. Co-authored a patent for thermally coupling memory DIMMs with a memory controller. Extensive hands-on electro-mechanical assembly and prototyping experience, using hand tools and light machine shop skills. Excellent written and verbal communication skills.