• Global account responsibility for electronic materials for Hewlett Packard, Inc. and their Personal Systems, Inkjet and LaserJet product lines with revenue 10M€+ per year. Responsible for strategic business plan, forecast and new project pipeline. Work with product development and marketing in definition of new materials to support the pipeline and HP’s needs.• Support NA sales for all customers in a business development role for the thermal interface material product line (TIM). Responsibilities include support at initial customer meeting through production fulfillment for existing TIM products and material definition with marketing/PD, through production for new materials. Provide training to NA sales for TIM• Worked with global operations team t manage the successful transition of all production adhesive products (12 unique adhesives) to a new green factory in South Korea for HP digital printing cartridges. 3 lots of samples and 3 rounds of pilot production for each product from the new factory while still maintaining uninterrupted regular production supply from the two old production sites all during the pandemic.• Key contributor to the manpower structure planning and the go-to-market plan forHenkel electronics assembly materials for the medical and appliance market segment spaces

Identify and develop new business opportunities for Henkel Electronics Materials thermal interface materials in the Computing, Data Storage and consumer electronics market segments.

Project Manager for new silicon wafer fabrication process development leading a cross-functional technical team in the realization of new processes for mixed-signal integrated circuits.

Led a cross-functional team in the development of digital storage-based integrated circiuts. Both HDD and consumer. Built customer relationships and managed the business process through the funnel. Negotiated schedules, specs and pricing.