• PC business unit head and organization leader for supply chain management, strategic sourcing, procurement engineering, demand planning, commodity management, and vendor relationships.• Achieved a 100% time to market delivery for $100M of annual internal & external customer hardware by building world class teams with a customer first mindset to enable $30B in annual CPU revenue.• Attained a 20% cost savings of $20M across annual supply chain spend through design for cost, contracted negotiations, preferred supplier agreements, and geo balancing of semiconductor selection, PCBA & laptop system procurement.• Achieved a 60% improvement in sustainability across all hardware through a reclaim, reduce, recycle, and reuse strategy and program implementation, additionally saving $8M annually.• Collaborated with Sales to attain new design wins with Tier 1 customers through the development and enabling of a highly resilient laptop Bill of Materials, and earned the Diamond Award from Lenovo for outstanding partnership on our customer reference designs.• Developed new diverse management leaders and principal engineers across multiple geos to force multiply best known practices throughout the company, with an emphasis on Design for Lead Time.• Innovated and implemented the use of AI and automation into Intel’s supply chain processes to reduce manual tasks, generate exceptional KPI visualization, and improve design cycle velocity.• Implemented the use of new software tools from SAP, Avnet, UiPath, and Microsoft to scale a lean and efficient workforce to own cradle to grave supply chain for the full product life cycle.

• Leader and builder of Intel’s Client Computing Group’s world class supply chain operations organization for the manufacturing of all Printed Circuit Board Assemblies (PCBAs) and laptop system hardware to enable silicon development and software validation.• Successfully built and managed a multi-geo organization of over 16 engineers and program managers, and together oversaw a $100M electronics and mechanical supply chain collaborating with design, manufacturing, finance, and legal to enable Intel to launch product 100% on time.• Achieved maximum supply chain resilience and 100% factory uptime through selection, utilization, and outstanding management of four EMS / ODM sites (Flex, Sanmina, ATC, internal) with designs spanning 170 component suppliers and 150 BOMs annually.• Attained $10M annual savings through new supplier development, and contract negotiations with PCB suppliers, semiconductor manufacturers, mechanical assemblies, and ODMs. • Built a better demand planning process to realize shorter lead times and increase yearly design cycles by 25% enabling engineering the ability to innovate one additional cycle per year.• Created a big idea with my 3PL warehouse that provided excess internal components to customers for critical supply chain needs enabling millions of dollars of additional CPU revenue.• Recognized for having the highest manager rating in my larger organization and the highest retention rate through strong focus of development of talent and hiring of top talent willing to learn and grow. This was recognized by corporate leadership, and I was promoted to the role above.

• Drove cross functional teams on an annual cadence consisting of laptop hardware design, software, factory management, supply chain, manufacturing, test, and quality. • Led product development and manufacturing readiness teams through the Platform Life Cycle designing and building $50M of laptop hardware annually for supply chain development, software enabling, and silicon debug. • Developed all supply chain operations processes and methodologies to train adjacent and future material program managers on best practices so the organization could have a standard operating program management office. • Hired and mentored seven program managers to grow the org’s bench for ability to provide leadership to the PLC. My leadership was recognized, and I earned the above opportunity to lead a larger organization and develop talent.

• Hardware product leader for smartphones and tablets, overseeing development and managing ODM factory operations.• Negotiated ODM and JDM contracts with Foxconn and Compal to co-develop and build all necessary systems and administered R&D budgets of $15M with all resources, tooling, software, prototypes, and samples.

• Started a financial services company with two business partners offering a fund to sophisticated investors with tax liens as the primary investment vehicle, rental properties, and partnered with law firms to exercise foreclosures. • Built algorithms to create auction bid models for ideal properties for the fund to purchase and acquire properties through foreclosure. Back tested the models every year to improve yield and foreclosure performance by 3X.

• Manufacturing enabling of chip package and PCBA technology into phone, tablet, and PC designs.• Co-engineering design of first Apple MacBook Air with Intel’s first ever thin core substrate package.• Technology strategist for first ultra mobile chip manufacturing developing platform roadmaps.• Development of world’s first chip package corner adhesive in collaboration with Apple, LG, and Samsung.

• New product development, design for manufacturing (DFM), and supply chain engineering on all printed circuit board assemblies. Earned Lean Six Sigma Green Belt for innovative supply chain project.• Lead engineer and project manager responsible for RoHS lead free manufacturing and supply chain transition for the entire company.

• Surface Mount Technology (SMT) development and sustaining support for in house manufacturing of all new circuit boards. Developed the company’s first pin in paste process to eliminate wave soldering and associated cost.• Developed the company’s first Highly Accelerated Life Testing process to ensure better printer reliability.

Engineer responsible for facility layout and new equipment acquisition.