Daniel Baumbach Email & Phone Number

Folsom, California, United States

I have taken a leadership role in the complete physical failure analysis process of NAND memory packaged units, with a primary focus on identifying and isolating specific failures. My demonstrated expertise spans various techniques, including:• Helios Dual Beam Focused Ion Beam (FIB): Experienced in performing targeted single bit Dual Beam FIB cross-sections for in-depth analysis. This includes Planar (P-TEM) and X-TEM Transmission Electron Microscope (TEM) sample preparation to identify physical defects.• Proficient in managing High-Value Inventory and Confidential Intellectual Property• Work in Progress (WIP) Management: Created and managed a WIP queue within SharePoint to efficiently track and prioritize ongoing projects.• Knowledge Sharing: Designed and led workshops to share knowledge and techniques with team members, thereby enhancing the capabilities of the laboratory.• IREM/OBIRCH Sample Preparation: Skills in preparing samples for IREM (Infrared Emission Microscopy) and OBIRCH (Optical beam induced resistance change).• Skilled in deprocessing layer by layer through the array and CMOS using topside and backside approaches. This involves a combination of wet chemistry etches, dry reactive-ion etches (RIE), and precision polishing techniques.• Die Isolation: Capable of isolating a single die (35 micron thick) from a multi-die stack while ensuring its functionality remains intact.• Collaborated closely with cross-functional team members to tackle complex memory device failure issues.• Documented and reported findings to contribute to Fab (fabrication) improvement efforts and enhance product yield.My experience and skills are instrumental in achieving a comprehensive understanding of failure analysis and contributing to the improvement of semiconductor device fabrication processes.

Folsom, California, United States

I have a proven track record in the development of Focused Ion Beam (FIB) sample preparation methods, showcasing my skills in writing Best Known Methods (BKMs), creating training documentation, and providing remote cross site training during the Covid shutdowns. My areas of expertise include Transmission Electron Microscopy (TEM) sample preparation of a single memory bit, NAND polysilicon grain size analysis, and the implementation of methods aimed at enhancing FIB sample success rates and throughput times.I am highly skilled in the creation of samples for TEM using a Helios Dual Beam FIB, with a specific focus on preparing targeted single bit 40nm samples for Optane Memory Technology Development and Pathfinding. As a dual beam FIB tool owner, I take on the responsibilities of first-line dual beam FIB troubleshooting, advanced beam alignments, consumable inventory management, and scheduling routine tool maintenance.My dedication and proficiency in FIB and TEM sample preparation are evident in my contributions to optimizing processes, troubleshooting, and maintaining the tools essential for high-quality sample preparation.

Santa Clara, California, United States

I played a crucial role in advancing next-generation server processor development through my expertise in Focused Ion Beam (FIB) circuit edit debug. My responsibilities also included FIB troubleshooting, managing consumable inventory, calibrations, and routine maintenance of essential tools.In addition to my technical work, I thoroughly documented my efforts by generating detailed reports and delivering presentations on circuit edit procedures and experiments. This ensured transparency and knowledge sharing within the team.Furthermore, I conducted in-depth failure analysis of circuit edits using a dual beam FIB, enabling us to identify and address any issues in circuit edits effectively.Overall, my role significantly impacted the development of advanced server processors, and I am committed to furthering such contributions in future endeavors.

San Jose, California, United States

Responsible for conducting a comprehensive failure analysis process on prototype hard disk drives. This process included tasks such as clean room disassembly, thin film media metrology, scanning electron microscope (SEM) imaging with energy-dispersive X-ray spectroscopy (EDS), and focused ion beam (FIB) cross-sectioning. Furthermore, I generated failure analysis reports based on my findings, which were utilized to contribute to the advancement of product development in this field.