Failure Analysis Engineering Technician - Nand Memory
Current- I have taken a leadership role in the complete physical failure analysis process of NAND memory packaged units, with a primary focus on identifying and isolating specific failures. My demonstrated expertise spans.
- Helios Dual Beam Focused Ion Beam (FIB): Experienced in performing targeted single bit Dual Beam FIB cross-sections for in-depth analysis. This includes Planar (P-TEM) and X-TEM Transmission Electron Microscope (TEM).
- Proficient in managing High-Value Inventory and Confidential Intellectual Property
- Work in Progress (WIP) Management: Created and managed a WIP queue within SharePoint to efficiently track and prioritize ongoing projects.
- Knowledge Sharing: Designed and led workshops to share knowledge and techniques with team members, thereby enhancing the capabilities of the laboratory.
- IREM/OBIRCH Sample Preparation: Skills in preparing samples for IREM (Infrared Emission Microscopy) and OBIRCH (Optical beam induced resistance change).