Design Engineer – Data Center Group – April 2013 through September 2015• Responsible for design and validation of socket loading mechanism for Intel server CPUs. Socket loading mechanism is a compact mechanical ‘clamp’ that retains the thermal solution and enables electrical interconnect between CPU and computer system by actuating the land grid array.• In the role of design engineer, collaborated with other engineers throughout product development cycle to design and validate socket loading mechanism. Experienced at using sketches, hand calculations, CAD tools, and FEA analysis to generate and refine design concepts.• Skilled producer of engineering drawings per ASME Y14.5 GD&T standard.• Ability to apply knowledge of a wide variety of materials and manufacturing methods to design concepts. Worked closely with overseas suppliers in Asia to improve design for manufacturability. • Experienced at communicating & defending ideas, requirements, timelines, data, and specific design intent to engineers within & outside my organization.

Mechanical Intern – Data Center Group – Summer 2011 & 2012• Supported product validation effort by executing test plans provided by engineers. Deep knowledge of validation practices, data collection, and data analysis.• Participated in root cause analysis of CPU thermal failure. Used optical CMM to characterize relationship between CPU package flatness and thermal interface performance.

Thermal Co Op – Central Engineering Group Fall 2011• Executed test plans to support thermal team responsible for enterprise telecommunications systems. • Responsible for applying measurement instrumentation, and collecting, analyzing & presenting data.