Under MT&E _ Asia, leading MPE ( Manufacturing Process & Engineering)

Engineering manager under AO Div.engineering organization cover finishing engineering, process integration, measurement and inspection, chemical related process engineering.

Finishing Engineering and Integration under Div. Engineering, PGS/AO/CSM.In charge of Finishing technology roadmap, new capability enablement, capability improvement, New Product Introduction, Process Integration.

Finishing Engineering ManagerAsia Region, base in ShangHai RHQPrecision Glass Solutions/AO/CSM.Leading local engineering team with overall finishing process from Slicing to end , cover CNC, Lapping, Polishing, Cleaning, Inspection and Metrology etc.Leading engineering projects to achieve and deliver the targeted output per Business Unit requirement.Cooperate with manufacturing sites to develop and enable the technology or capability to meet market… Show more Finishing Engineering ManagerAsia Region, base in ShangHai RHQPrecision Glass Solutions/AO/CSM.Leading local engineering team with overall finishing process from Slicing to end , cover CNC, Lapping, Polishing, Cleaning, Inspection and Metrology etc.Leading engineering projects to achieve and deliver the targeted output per Business Unit requirement.Cooperate with manufacturing sites to develop and enable the technology or capability to meet market trend.New Product Introduction and transfer to Mass production phase. Show less

Jun'2017 to May'2018Head of Department for Process Integration IV under Fab7 (300mm) PI&YE organizationLead critical customer account across various technologies from 0.130um to 40nm node and convergence team for Global shuttle, FTPS , substrate engineering etc.Mainly focus on Product (Device) electric performance and die yield improvement, drive process improvement for margin and cost saving projects etc. Management of interface with customer foundry engineering/quality team… Show more Jun'2017 to May'2018Head of Department for Process Integration IV under Fab7 (300mm) PI&YE organizationLead critical customer account across various technologies from 0.130um to 40nm node and convergence team for Global shuttle, FTPS , substrate engineering etc.Mainly focus on Product (Device) electric performance and die yield improvement, drive process improvement for margin and cost saving projects etc. Management of interface with customer foundry engineering/quality team toward excellence of product and quality.Jul'2016 ~ May'2017Manager of convergence team in Jul'2016 under PI&YE and mainly focus on process BKMs fan-out with most advance node in Singapore Fab, continuous to drive substrate quality and cost-down project.Nov'2014 ~ Jun'2016 Re-joined Globalfounries in 2014 as Program Manager in charge of critical U.S customer with most advance tech node in Singapore under Process integration and Yield Engineering organization. Mainly focus on device yield and FT improvement. Coordinate substrate engineering/CIP as cross function as consolidation. Show less

Mar2012 ~ Jul2014 Senior Dept. Manager of Integration in 2012 located in Taiwan plant (Taisil) . Mainly focusing on internal Fab yield&FPY (First Pass Yield) improvement through YEM methodology. Also focus on qualification sample preparation (OTD & FTPS) / product & technology transfer / cost down etc. to support with Company's KPIs. Be the member for task force team with critical accounts (Foundry customers as TSMC and Globalfoundries) to support with CIPs implementation/technical… Show more Mar2012 ~ Jul2014 Senior Dept. Manager of Integration in 2012 located in Taiwan plant (Taisil) . Mainly focusing on internal Fab yield&FPY (First Pass Yield) improvement through YEM methodology. Also focus on qualification sample preparation (OTD & FTPS) / product & technology transfer / cost down etc. to support with Company's KPIs. Be the member for task force team with critical accounts (Foundry customers as TSMC and Globalfoundries) to support with CIPs implementation/technical engagement. Be the 300mm VF coordiator regarding "Product Excellence" project , develop new concept and drive the progress across 300mm Manufacturing Fabs in order to meet customer's expectation and capability improvement to be competitive on worldwide suppliers . Involved with Cleaning/Inspection/Epi process improvement (Acting manager for related modules), driving key/critical improvement regarding particle/flatness improvement etc.Jan2011 ~ Feb2012Join MEMC as Senior Manager of Taiwan FAE team(Field Application Engineering) under Sales organization in 2011, in charge of Key semiconductor customer account regarding Si wafers, also include Key solar cell customer account regarding Multi/Mono wafers. Work closely with Sales manager for the technical portion and technology engagement with customer's Technical/Quality contact window. Focus on specification development , TCR (Technology Coverage Rate), gain qualification opportunities, customer advisories follow-up etc. Show less

Project orientated to drive D0/IDU under 65nm programs(U.S account with smartphone processor/wifi chip) while joined GF. Mainly focus on FEOL/BEOL defect reduction by co-working with Module Engineering. Also coordinate with IDU project, include key process uniformity improvement across modules and also develop APC for variation reduction and BEOL resistivity performance. Migrate and be the section manager of "Integrate Module Enigeering" under PI organization, mainly focus on overall… Show more Project orientated to drive D0/IDU under 65nm programs(U.S account with smartphone processor/wifi chip) while joined GF. Mainly focus on FEOL/BEOL defect reduction by co-working with Module Engineering. Also coordinate with IDU project, include key process uniformity improvement across modules and also develop APC for variation reduction and BEOL resistivity performance. Migrate and be the section manager of "Integrate Module Enigeering" under PI organization, mainly focus on overall baseline D0 improvement include both soft/hard failures for 65nm/45nm inclusive of Bulk/SOI. Develop BKMs with Modules and coordinate for the fan-out progress to ensure the process alignment. Also be invloved with several tasks, i.e litho immersion defect reduction by working with vendor by setting short loop test vehicle to ensure the process stability and work on the improvement activities. Also involved with early technology engagement with 40nm for key failures analysis and identify improvement activities before hands-on to production. Show less

Started with semiconductor fabrication as process engineer in Etching dept. Main responsibility is to maintain/develop process for STI/Gate Dry plasma etch across 0.18um node till 65nm node. Also familar with BEOL Metal Hardmask etching/AL metal&Pad etching/Solvent cleaning/Stripper process etc. Strong skills for problem solving and process improvement and also be in charge of APC for CDU improvement project. Transfer to Process integration in 2006 and handling device yield belong to… Show more Started with semiconductor fabrication as process engineer in Etching dept. Main responsibility is to maintain/develop process for STI/Gate Dry plasma etch across 0.18um node till 65nm node. Also familar with BEOL Metal Hardmask etching/AL metal&Pad etching/Solvent cleaning/Stripper process etc. Strong skills for problem solving and process improvement and also be in charge of APC for CDU improvement project. Transfer to Process integration in 2006 and handling device yield belong to 90nm/65nm (U.S account with FPGA) technology. Be the coordinator for BEOL yield enhancement to drive related D0 performance in order to meet the roadmap and customer expectation. Show less

In charge of slurry/coater process.

In charge of plating process

VRLA battery designer for 100/88/75 Ah with 12V cell