Operation of small business providing Scanning Electron Microscopy and Failure Analysis services. SEM Lab, Inc. provides failure analysis, materials characterization, scanning electron microscopy (SEM) and FTIR services. We specialize in failure analysis of electronic assemblies, printed-circuit-boards (PCBs) or printed-wiring-boards (PWBs), and electronic components such as integrated circuits (ICs), memory chips, transistors, diodes, capacitors, resistors, light emitting diodes (LEDs), power modules, and many others.

Senior Quality Engineer in Product Assurance Organization responsible for root cause failure analysis of dead-on-arrival (DOA) product. Supervised staff of four failure analysis technicians and five product quality auditors. Performed failure investigations and developed technical recommendations for corrective action. Analyzed extensive product failure database to identify new failure trends. Published corporate DOA monthly report identifying failure rate by product model. Developed new failure analysis methods and techniques.

Lead Engineer in Product Analysis Laboratory performing failure analysis, SEM/EDS analysis, construction analysis, non-destructive testing, manufacturing problem solving, material support, and product development support for OEM electronic and electro-acoustic products. Strong problem solving skills including failure mode identification, physics of failure description, and corrective action. Performed more than 900 analysis tasks on integrated circuits, hybrid circuits, discrete components, magnetics, fine pitch surface mount technology, through-hole technology, printed wiring boards, thick-film ceramic, mechanical components, and injection molded plastic parts. Developed a unique automated computer controlled power cycling test system for reliability testing and supplier control for printed wiring boards. Resident expert in soldering technology including reliability prediction, solder mechanical behavior, solder joint design and soldering process improvement. Provide failure analysis and consulting services for a variety of local manufacturing companies.

Developed high density (284 I/O, 11-mil pitch) electronic module assembly processes including lead form and excise, lead tinning, component placement and solder reflow. Applied Design of Experiments and Statistical Process Control techniques to improve process yields. Received Honeywell's "Technical Achievement Award" for development of unique computer controlled assembly machines including a semi-automatic fine pitch placement system, a fully automatic fine pitch tinning system, and a focused infrared connector soldering system. Performed feasibility investigation for implementation of Vanzetti Solder Inspection System on surface mount electronic modules.

Developed fine pitch surface mount assembly processes including screen printing and reflow soldering. Utilized thermal shock testing, high temperature storage tests, cleanliness tests and solderability tests for process analysis and validation. Team leader for the implementation of the "Life Test Program" which provided life test parameters and analytical models for improving designs and predicting performance of soldered assemblies.

Worked in advanced electronic packaging design group developing surface mount electronic assemblies for high reliability applications. Used Computer Vision CADDS4X work stations to develop and document designs. Supported electronic packaging material selection and trade off evaluations. Developed injection molded low insertion force pin grid array socket. Performed an in-depth Surface Mount Technology - Rework and Repair Technology study.