Ed Knutson Email & Phone Number

Burnsville, Minnesota, Us

At Dimation, we are dedicated to providing our customers the highest level of service possible. Understanding that time-to-market is extremely critical, we often make the difference between success and failure by providing Quick-Turn, Walk-In and Evening service to help you meet your customer’s deadlines. By offering expertise in areas such as COB (Chip on Board), COF (Chip on Flex) assembly, Leadless component assembly, SMD assembly, Wafer sawing, Die inspection and Auto wire bond capabilities, we help our customers compete in their market by using the latest packaging technologies available. Our mission is to be the best in the industry, making our customer’s requirements our priority while providing professional service that is both responsive and flexible. Whether the job is large or small, consignment or turnkey, our customers receive nothing less than the best we have to offer. That is our pledge to all our customers.

Vieira Systems is an innovative think tank of specialized talented engineers, technicians and assembly support personnel that help inspire true ideas paving the way to develop new technologies. By offering support in areas such as hardware and software design, we provide solutions for many technologies including that of military & defense, medical, automotive and other specialized industries that require highly innovative new products or services.

Eden Prairie, Mn, Us

Provided Project Management support for low volume, high mix/high complexity surface mount technology (SMT) placement including ball grid array (BGA) and flip chip as well has pin through hole (PTH) printed circuit board assemblies. Other responsibilities inlcuded QMS preparation for ISO Certification and Network Administration support.

Packaging Support for Radio and Video chipsets for newHD technology. Provided Bench Technical support, process development and BOM creation for System Development boards.

Plymouth, Minnesota, Us

Developed EDS system (Electronic Database System) to act as a productivity enhancement tool for SMD Engineering program support. Overhauled and restructured program generation process to provide rapid response to engieering request while providing quality and error free programs. Provided technical and problem analysis for SMD Engineering and Product Services. Asissted in development of a precision robotic pick and place system, software programming and training of Hybrid personel. Analized product failures and provided technical solutions to improve product yeilds. Implemented training and certification procedures and support for manufacturing personel while providing an enviorement for motivation. Provided enginnering and product development support for protype packaging group.

Us

Responisble for leadership, direction and quality assurance suport for manufacturing. Provided technical and mechanical support for manufacturing equipment. Implemtented process improvemnet tools and techniques to improve product yields. Developed process documentation and procedures for hybrid and production assembly.

Provided leadership and direction for Production, SMD, Hybrid and assembly. Project Leader, trainer for aluminum wedge bonders and gold ball wire bond lines. Also provided process and product yield improvements stradegies for manufacturing.

Us

Provided engineering and product development suport for Prototype Packaging Group. Developed process and procedures for heat sensitive CMOS devices requiring eutectic and silver glass epoxy die attach. Obtained knowledge and experience for TQM and JUST-IN-TIME (J.I.T.) concepts and practices. Specific Areas of Expertise:•Aluminum Wedge Bonding, Manual and Automatic•PGA Prototype Development / Assembly •COB Chip on Board, Monolithic and Hybrid Prototype Development / Assembly •Eutectic and Epoxy Die Attach Process Development / Assembly •Flip Chip Assembly / Process Development / Assembly•Gold Ball Wire Bonding Manual and Automatic•JIT Manufacturing•TAB Tape Automated Bonding Prototype Design•Wafer Sawing•Wave Soldering / Process Development Through Hole Assembly•Welding / Brazing

Microsoft Mcse Certified, Nework Engineer

Associate, Law / Certified Paralegal

Associate, Avionics