Ed Lua Email & Phone Number

• Experienced and passion for IC advanced packaging and like to work in a start-up company. • Good fundamentals in the advanced packaging processes, critical to quality materials properties and its materials thermal characterization for polymeric materials like DSC, TGA, and DMA.•Knowledgeable in the backend assembly equipment like Besi, KNS, ASM, STI, Camtek, Asymtek, Muhlbauer, MiT, DISCO, ACCRETECH, LPKF, KOSES, Lintec equipment.•Currently managing a team of managers, engineers, and technicians working in module optical packaging and backend optics packaging.•Familiar with IC packaging or backend assembly like Si back grinding, dicing, wire bonding, die attach, lens attach, flip chip, automatic optical inspection, screen printing, tape n reel, and module sorting.• Apply quality tools like FMEA, 8D report, CAPA, Control Plan, SPC, MSA, and Pareto Chart.•Familiar with the ISO9001 standards. Certificate in Internal QMS Auditor in the Year 2014.•Lead process team to work on improvement activities to further improve the yield, UPH, Cpk, and productivity to resolve and enable the project to be able to ramp in a high volume environment successfully.•Collaborate with operation teams (maintenance, production, product) to ensure timely qualification of all the equipment, BOM, control plan, FMEA and SOP needed for mass production.•Part of the technical team to be involved in any technical related issue, reliability or yield issue faced in the development and production stage.•Present to customers on the project status, and follow-up on customers’ queries on technical, process yield-related packaging materials, equipment and processes.•Develop process and equipment qualification template for each assembly step for the customer’s qualification build from the prototyping stage to the ramp stage.•Coordinate line visits and audits with the customers for new products.•Provide technical support and project reviews with the project management group at the ramp stage for projects run in Subcon assembly like Hana and Amkor.•Hold 4 patents in the advanced packaging.•Bachelor's degree in Materials Science Engineering from Nanyang Technological University in Year 2000. •Certificate in PI-PH-307E-1 Apply Manufacturing Technologies In A Regulated Environment in Year 2015. (Pharmaceutical course which covers various aspects of FDA, ISO13485, GMP, CFR 21 and ICH Q10)•Certificate in MF-COM-402C-1 Apply Project Management Skills in Year 2014.• Well-versed in Canva, ChatGPT, and various Generative AI tools for SEO and Marketing Research.

• 

  Optical Packaging Assembly Senior Manager

  Ams Osram

  Singapore