Principal Member Of Technical Staff
Current• Manage packaging design and assembly to support business unit needs in new product introduction(NPI) and cost reduction; Support wide range packages from simple low pin count to high speed flip chip package; • Develop the package road map and provide technical guidance to business units and manage/execute the associated schedule; Maintain the Assembly Design Rule to guideline MAXIM IC designers; • Extensive experience in Cu wire qualification for TSMC, UMC and MAXIM fab process. Solved many quality issues for the Cu wire processes;• Cost reduction activities, including the qualification of low cost suppliers and introduction of new packaging;• Meeting with internal and external customers to solve packaging issue; maintaine clear communications internally to meet product requirements