Senior Product Engineer (E4)
Current(E4) SR ENGINEER NVEG PE (Product Engineer, 2013 – Present)• Excels in performing secondary electrical failure analysis (EFA) of NAND products, isolating root cause of NAND units• In depth FA for NAND components for RMA units returned by customers• Perform simulations to understand how the signal behaves within the circuit.• Modify programs for targeted EFA experiments• Develop improved or new detection plans to filter out similar RMA (customer return) circuit faults and improve the quality of NAND products• Experience with Cadence Circuit Tracing• Deep understanding of 3D NAND and 2D NAND defect mechanisms• Develop advanced software tools to make uMate tester more powerful, such as rollback backup system, getvt macros and their data wrapper and GUI script, and support existing EFA tools such as PIV and cell current tools.• Develop many useful software inventions to ensure our company's technological competitiveness, such as ROM block pattern recognition with AI, automatically generated probe axcel tests in bench tests, automatic MNAND project generation, NAND RG bench Vt sweeping tool designs and trim tool option to group by probe tests.Probe Engineer (2011-2013)• Work with Waferfab process/integration group to troubleshoot process related defects affecting Nand product yield.• Perform detailed electrical chip failure analysis and utilize isolation techniques (oscilloscope) to identify root cause of failure.• Perform in-depth NAND CMOS layout studies and circuit debugging using CAD tools, simulations as well as micro probing tools.• Review Nand Flash Fab wafer probe test code (C++) before it is released for a new revision.• Debug and develop some test programs and provide feedback for production test changes. (In C++ and APG code)• Use statistical tools and software for data analysis and to support critical process changes.