Strong materials background developed through failure mode analysis experience in electronics, semiconductor, automotive and decorative applications.Management of technical personnel in R&D and Customer/Technical Service laboratories.Intimately familiar with materials analysis tools, such as, FIB/SEM, SEM/EDS, XRF, Auger Spectroscopy, UHV Systems, metallographic sectioning techniques and a wide variety of other techniques from related disciplines.Technology and Technical Service management for a major telecom product development center.Extensive experience in the field of electro-deposition, materials properties, corrosion, metallurgy, accelerated life testing and related processes covering product development and technical support/service.A creative and logical approach to solving complex problems requiring experience-based judgment including experimentation and evaluation of results.Technically proficient in use of oral and written communication skills.Skilled in the packaging and presentation of technical information to customers and staff at all levels.Authored or co-authored six patents and twenty-eight publications. Extensive background in effective use of PC-based hardware and software.Specialties: Formulation of electrodeposition processes.Materials characterization.Failure mode analysis of coating on metals and plastic substrates.Plating, Electroplating, Corrosion, Wear, Metal Finishing, Metallurgy, Metallography,FIB/SEM, SEM/EDS, Auger, XRD, XRF, Microscopy, others.