I led Intel's team of AI software product managers, who were responsible for the software portfolio across Intel platforms, including open source initiatives and products that enable developers to do more with AI on Intel platforms. Our efforts accelerated customer adoption of Intel platforms and the Intel Developer Cloud (IDC) for AI, through our prioritization of out of box experience and cloud scale performance across key models & stacks (PyTorch, DeepSpeed, Hugging Face and more) across a growing range of Intel platforms. Our team also laid the foundation for framework builders to support multi-vendor hardware through common open standards (UXLfoundation.org), seeded the ecosystem with a fast-growing open platform for enterprise AI to accelerate adoption (www.OPEA.dev), and much more.

My team's scope increased to span AI product marketing and sales enablement, with responsibility for the full-funnel from awareness to deployment. In addition to continuing our work training Intel's global sales force and consulting directly with customers, we took on responsibility for the top of funnel awareness and consideration motions. Our product messaging and marketing efforts generated over 300M+ impressions annually with high engagement and lead gen, through paid campaigns, product launches, activations at top AI events (NeurIPS, CVPR, ICML, Intel ON & more), customer storytelling, digital marketing, internal comms, and more. Moreover, the "go big" AI marketing strategy that we defined was implemented as plan of record once substantial new funding was finally approved in late-2022, even after I had moved "upstream" to my new role in as Intel's AI software product management lead.

I led Intel's AI sales enablement team, which trained Intel’s global sales force on AI consultative and technical sales, enabling them to scale machine learning and deep learning revenue to over $5B annually despite hardware roadmap challenges versus competition. We also directly engaged with customers, consulting for at least one enterprise per quarter on deploying AI in production, across verticals including finance, healthcare, industrial, telecommunications, government and many more.

I drove the full product lifecycle for a new AI & HPC microprocessor line, including planning, execution and go-to-market. I collaborated cross-functionally with design, architecture, software, manufacturing, marketing, finance, sales, partners and customers to deliver a product at the forefront of high-performance computing and artificial intelligence. Our team's customer-obsessed, agile approach to software and hardware enablement at scale powered the world’s #1 supercomputer on the 2012 GREEN500 (Beacon) and 2013 TOP500 (Tianhe-2) lists, advancing high-performance computing workloads globally. Through securing design wins with all major OEM/ODM system providers and launching both early shipment and starter kit programs, we were able to scale the product to 100+ enterprise customers within 1 year of product launch.

I completed 3 rotations in Intel’s prestigious rotational general management program, which was designed by Intel's executive team to attract and develop top MBA graduates who have a passion for technology, and the potential to become Intel's most influential leaders.ROTATION #1 (8 months): As a product marketing manager in the Internet of Things (IoT) group, I developed the go-to-market strategy for a new video analytics coprocessor venture.ROTATION #2 (8 months): As a strategic planning manager in the Technology & Manufacturing Group (TMG), I chaired a new taskforce that discovered $100M+ of inefficiencies in strategic capital equipment supplier plans and secured 2 headcount to implement a strategy that would solve the problem.ROTATION #3 (8 months): As an outbound product marketing manager in the Data Center Group (DCG), I led a 30-member cross-functional team to deliver Intel presence that “stole the show” (Source: HPCwire) at the International Supercomputing (ISC’12) high-performance computing (HPC) event.

As a marketing leader in the Intel Education group, I planned & launched the Intel Education Service Corps program, a corporate social responsibility (CSR) initiative for employees to deploy Intel technology to underserved schools and orphanages. Since launch, the program has benefited 100K+ students and teachers across 20+ developing nations, through the generous support of Intel and over 1,000 employees. To find out more here, visit the link below.

As a microprocessor design engineer and team lead at IBM, I worked across the engineering organization on the global integration and clock distribution for several high-profile microprocessors, including: Cell processor (Playstation 3), Xbox 360 processor, POWER 6, PowerXCell 8i, and POWER 7. In addition to microprocessor design, I developed tools, methodologies and processes to improve design and implementation. My individual efforts and leadership of a team of six engineers, directly led to schedule pull-ins (up to 1 month) and power reduction (up to 8%). In 2006, I was invited to the early tenure conference as one of IBM's 80 most innovative young employees, and designated to the company's Top Talent program.

As a VLSI design engineer at Philips Semiconductors (now NXP Semiconductors), I delivered an analog circuit design for a 90nm cellular phone testchip, in under half the expected design time. I was selected for this unique opportunity through the International Association for the Exchange of Students for Technical Experience (IAESTE). Find out more: www.iaeste.org

As a software development intern in IBM's pervasive performance group, I performed debug on the WebSphere portal for personal digital assistant (PDA) synchronization, finding and resolving numerous bugs that would have resulted in customer issues.