Elizabeth Friend Email and Phone Number
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PhD in Materials Science (MIT 2007) with over 5 years of experience as a process engineer in various industries (flat panel display, semiconductor) and over 5 years of research experience fabricating & characterizing magnetic and oxide thin film materials. Highly experienced at process analysis and troubleshooting, statistical process control and continual improvement via designed experiment (DOE). Cross-trained across all semiconductor manufacturing sectors (lithography, etch, diffusion, thin films / CMP and yield / defects) through Spansion's Rotation Engineer program. Intelligent, articulate professional with proven abilities to work both independently and with diverse groups from manufacturing to research and development.Objective: integration engineer or process engineering position, preferably R&D or capital equipmentSpecialties: ALD, CMP, PVD, sputter deposition, materials characterization thin films, process documentation, statistical process control, designed experiments, yield analysis.
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Technologist, Hardware Development EngineeringWestern DigitalUnion City, Ca, Us -
Principal Engineer, Hardware Development EngineeringWestern Digital Mar 2020 - PresentSan Jose, Ca, Us -
Senior Thin Film Manufacturing EngineerHeadway Technologies Nov 2012 - Mar 2020Milpitas, Ca, UsVacuum group, manufacturing engineering group - responsible for ALD deposition of alumina and ruthenium layers (including new precursor process development) and PVD deposition (DC and RF magnetron sputter) of metal seed layers, as well as magnetic vacuum annealing and XRF metrology -
Senior Member Of Technical StaffRambus Feb 2012 - Oct 2012San Jose, Ca, UsWorked closely with product and device engineering to characterize and improve thin film materials properties and device performance of sputtered conductive metal oxides and ALD deposited tunnel barriers for novel memory technology. Performed statistical analysis of experiments to understand and improve device performance.Note: Rambus acquired Unity Semiconductor in February 2012 -
Senior Process Development EngineerUnity Semiconductor Mar 2011 - Feb 2012Worked closely with product and device engineering to characterize and improve thin film materials properties and device performance of sputtered conductive metal oxides and ALD deposited tunnel barriers for novel memory technology. Performed statistical analysis of experiments to understand and improve device performance.
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Process Development EngineerUnity Semiconductor Oct 2009 - Mar 2011In conjunction with device engineering, I am working to understand how changes to thin film material properties affect device performance. I am also supporting efforts to improve yield of prototype memory devices via statistical analysis of device electrical data.
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Senior Manufacturing EngineerSpansion Sep 2006 - Feb 2009Sunnyvale, Ca, Us• Thin Films / CMP group. Supported all FEOL CMP and post-CMP surface clean processes / tools. Continual optimization of process performance. Saved tens of thousands of dollars through early detection of substandard consumables. Improved throughput by removing unnecessary procedures, combining duplicate process steps and reducing the need for engineering involvement. Worked to design and scale up processes for high volume manufacturing. Mentored new engineers.• Rotation engineer training program. 1 year internship featuring cross-training and engineering projects in all major semiconductor manufacturing sectors: photolithography, etch, diffusion, thin films and defects / yield. -
Engineer, Faceplate & Chem OpsCandescent Technologies 1997 - 2000Us• Chemical Operations group: Slurry process - Monitored critical process parameters using statistical process control; wrote process documentation and trained technicians; characterized analytical procedures using gage repeatability and reproducibility studies; scaled up processes for medium volume manufacturing.• Screening Group: Dry etch and metal deposition processes - Wrote process documentation, programmed process control flows, worked with teams to reduce process variation using designed experiments. • Screening Group: Test Processes - Monitored yield and performed failure analysis of prototype parts using ultra high vacuum electronic equipment. -
Associate EngineerTelegen Display Laboratories 1996 - 1997Prepared and analyzed samples using gravity settling and electrophoretic deposition to evaluate luminescent materials for vacuum fluorescent displays. Operated and maintained ultra high vacuum and high voltage electronic systems. Worked with mechanical engineers and vendors to design fixtures for ultra high vacuum, high temperature sample analysis.
Elizabeth Friend Skills
Elizabeth Friend Education Details
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Massachusetts Institute Of TechnologyOptical And Magnetic Materials) -
Harvard UniversityChemistry -
Head-Royce School
Frequently Asked Questions about Elizabeth Friend
What company does Elizabeth Friend work for?
Elizabeth Friend works for Western Digital
What is Elizabeth Friend's role at the current company?
Elizabeth Friend's current role is Technologist, Hardware Development Engineering.
What is Elizabeth Friend's email address?
Elizabeth Friend's email address is el****@****ail.com
What is Elizabeth Friend's direct phone number?
Elizabeth Friend's direct phone number is +120996*****
What schools did Elizabeth Friend attend?
Elizabeth Friend attended Massachusetts Institute Of Technology, Harvard University, Head-Royce School.
What are some of Elizabeth Friend's interests?
Elizabeth Friend has interest in Poverty Alleviation, Social Services, Environment, Economic Empowerment.
What skills is Elizabeth Friend known for?
Elizabeth Friend has skills like Thin Films, Design Of Experiments, Semiconductors, Spc, Pvd, Materials Science, Process Engineering, Metrology, Jmp, R&d, Characterization, Sputter Deposition.
Who are Elizabeth Friend's colleagues?
Elizabeth Friend's colleagues are Jay Glanville, Dan Hassani, Lilin Zhao, Joshoa Cabuslay, Nirosha Thanapathy, Mahmud Asfur, Neil Robertson.
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