Elizabeth Friend

Elizabeth Friend Email and Phone Number

Technologist, Hardware Development Engineering @ Western Digital
Union City, CA, US
Elizabeth Friend's Location
Union City, California, United States, United States
About Elizabeth Friend

PhD in Materials Science (MIT 2007) with over 5 years of experience as a process engineer in various industries (flat panel display, semiconductor) and over 5 years of research experience fabricating & characterizing magnetic and oxide thin film materials. Highly experienced at process analysis and troubleshooting, statistical process control and continual improvement via designed experiment (DOE). Cross-trained across all semiconductor manufacturing sectors (lithography, etch, diffusion, thin films / CMP and yield / defects) through Spansion's Rotation Engineer program. Intelligent, articulate professional with proven abilities to work both independently and with diverse groups from manufacturing to research and development.Objective: integration engineer or process engineering position, preferably R&D or capital equipmentSpecialties: ALD, CMP, PVD, sputter deposition, materials characterization thin films, process documentation, statistical process control, designed experiments, yield analysis.

Elizabeth Friend's Current Company Details
Western Digital

Western Digital

View
Technologist, Hardware Development Engineering
Union City, CA, US
Website:
wdc.com
Employees:
22750
Elizabeth Friend Work Experience Details
  • Western Digital
    Technologist, Hardware Development Engineering
    Western Digital
    Union City, Ca, Us
  • Western Digital
    Principal Engineer, Hardware Development Engineering
    Western Digital Mar 2020 - Present
    San Jose, Ca, Us
  • Headway Technologies
    Senior Thin Film Manufacturing Engineer
    Headway Technologies Nov 2012 - Mar 2020
    Milpitas, Ca, Us
    Vacuum group, manufacturing engineering group - responsible for ALD deposition of alumina and ruthenium layers (including new precursor process development) and PVD deposition (DC and RF magnetron sputter) of metal seed layers, as well as magnetic vacuum annealing and XRF metrology
  • Rambus
    Senior Member Of Technical Staff
    Rambus Feb 2012 - Oct 2012
    San Jose, Ca, Us
    Worked closely with product and device engineering to characterize and improve thin film materials properties and device performance of sputtered conductive metal oxides and ALD deposited tunnel barriers for novel memory technology. Performed statistical analysis of experiments to understand and improve device performance.Note: Rambus acquired Unity Semiconductor in February 2012
  • Unity Semiconductor
    Senior Process Development Engineer
    Unity Semiconductor Mar 2011 - Feb 2012
    Worked closely with product and device engineering to characterize and improve thin film materials properties and device performance of sputtered conductive metal oxides and ALD deposited tunnel barriers for novel memory technology. Performed statistical analysis of experiments to understand and improve device performance.
  • Unity Semiconductor
    Process Development Engineer
    Unity Semiconductor Oct 2009 - Mar 2011
    In conjunction with device engineering, I am working to understand how changes to thin film material properties affect device performance. I am also supporting efforts to improve yield of prototype memory devices via statistical analysis of device electrical data.
  • Spansion
    Senior Manufacturing Engineer
    Spansion Sep 2006 - Feb 2009
    Sunnyvale, Ca, Us
    • Thin Films / CMP group. Supported all FEOL CMP and post-CMP surface clean processes / tools. Continual optimization of process performance. Saved tens of thousands of dollars through early detection of substandard consumables. Improved throughput by removing unnecessary procedures, combining duplicate process steps and reducing the need for engineering involvement. Worked to design and scale up processes for high volume manufacturing. Mentored new engineers.• Rotation engineer training program. 1 year internship featuring cross-training and engineering projects in all major semiconductor manufacturing sectors: photolithography, etch, diffusion, thin films and defects / yield.
  • Candescent Technologies
    Engineer, Faceplate & Chem Ops
    Candescent Technologies 1997 - 2000
    Us
    • Chemical Operations group: Slurry process - Monitored critical process parameters using statistical process control; wrote process documentation and trained technicians; characterized analytical procedures using gage repeatability and reproducibility studies; scaled up processes for medium volume manufacturing.• Screening Group: Dry etch and metal deposition processes - Wrote process documentation, programmed process control flows, worked with teams to reduce process variation using designed experiments. • Screening Group: Test Processes - Monitored yield and performed failure analysis of prototype parts using ultra high vacuum electronic equipment.
  • Telegen Display Laboratories
    Associate Engineer
    Telegen Display Laboratories 1996 - 1997
    Prepared and analyzed samples using gravity settling and electrophoretic deposition to evaluate luminescent materials for vacuum fluorescent displays. Operated and maintained ultra high vacuum and high voltage electronic systems. Worked with mechanical engineers and vendors to design fixtures for ultra high vacuum, high temperature sample analysis.

Elizabeth Friend Skills

Thin Films Design Of Experiments Semiconductors Spc Pvd Materials Science Process Engineering Metrology Jmp R&d Characterization Sputter Deposition Atomic Layer Deposition Sputtering Chemical Mechanical Polishing Thin Film Characterization Semiconductor Process Statistical Data Analysis Data Analysis Memory Magnetics Cmp Capacity Building International Development Nonprofits Proposal Writing Sustainable Development Strategic Planning Research Fundraising Grants Grant Writing Program Development Program Management Non Profits Social Media Qualitative Research Social Impact Survey Design

Elizabeth Friend Education Details

  • Massachusetts Institute Of Technology
    Massachusetts Institute Of Technology
    Optical And Magnetic Materials)
  • Harvard University
    Harvard University
    Chemistry
  • Head-Royce School
    Head-Royce School

Frequently Asked Questions about Elizabeth Friend

What company does Elizabeth Friend work for?

Elizabeth Friend works for Western Digital

What is Elizabeth Friend's role at the current company?

Elizabeth Friend's current role is Technologist, Hardware Development Engineering.

What is Elizabeth Friend's email address?

Elizabeth Friend's email address is el****@****ail.com

What is Elizabeth Friend's direct phone number?

Elizabeth Friend's direct phone number is +120996*****

What schools did Elizabeth Friend attend?

Elizabeth Friend attended Massachusetts Institute Of Technology, Harvard University, Head-Royce School.

What are some of Elizabeth Friend's interests?

Elizabeth Friend has interest in Poverty Alleviation, Social Services, Environment, Economic Empowerment.

What skills is Elizabeth Friend known for?

Elizabeth Friend has skills like Thin Films, Design Of Experiments, Semiconductors, Spc, Pvd, Materials Science, Process Engineering, Metrology, Jmp, R&d, Characterization, Sputter Deposition.

Who are Elizabeth Friend's colleagues?

Elizabeth Friend's colleagues are Jay Glanville, Dan Hassani, Lilin Zhao, Joshoa Cabuslay, Nirosha Thanapathy, Mahmud Asfur, Neil Robertson.

Free Chrome Extension

Find emails, phones & company data instantly

Find verified emails from LinkedIn profiles
Get direct phone numbers & mobile contacts
Access company data & employee information
Works directly on LinkedIn - no copy/paste needed
Get Chrome Extension - Free

Download 750 million emails and 100 million phone numbers

Access emails and phone numbers of over 750 million business users. Instantly download verified profiles using 20+ filters, including location, job title, company, function, and industry.