Elliott Wu Email and Phone Number

Supporting reliability for the central compute module for autonomous vehicle development (Cruise Origin)Carrying out board level reliability testing for custom silicon solutions based on AEC standardsLeading DFMEA to document and tabulate risks and mitigations starting at ideation for next generation moduleGuiding internal execution of component level reliability efforts and designs of experiments, including hands-on testing involvementCoordinating with manufacturing partners to unblock reliability testing efforts overseas both remotely and on-siteConducting supplier audits for reliability testing and authoring audit reports for management during sourcing phaseLogging and documenting failures through use of a living DFMEA document and JIRA

Led module level product reliability efforts on emergent force sensitive touch solutions for OEM B2B applications, primarily as haptic laptop trackpadsManaged module assurance from mock-up to mass production volume ramp to support development of Lenovo X1 Titanium haptic trackpad Coordinated with external manufacturing partners (materials suppliers and module contract manufacturers) for ongoing reliability testing at overseas facilitiesRepresented Sensel reliability engineering in a high visibility role with external OEM engineering teamsPlanned and executed reliability testings suites to address program risks and insure product integrityCommunicated reliability results through written reports to various teams internal and external

Working across multiple engineering teams (reliability, product development, battery cell validation) to support development and testing of Nest Security system and other Nest productsConducting reliability and product development testing within a lab environment (Accelerated testing, drop testing, tensile/shear testing, vibration, chemical and UV exposure) to meet product integrity goalsPerforming failure and root cause analysis of test and field units (x-ray, cross section, micro-scratch, TGA/DSC)Qualified Instron MF 30 polymer melt flow tester for internal testing of materials through gage R&R

Developed optical flip chip process using solder wetting principles to achieve self-aligning optical componentsImplemented die bonding by surface mount BGA solder reflow process and cross section and x-ray characterization of solder jointsAnalyzed a silicone underfill curing issue; managed vendors to source and screen new materials and researched literature regarding silicone polymerizationInvolved in design of experiments design and applicationCreated SOPs for and trained technicians in use of die bonding and metrology equipment

Expanded automated metrology systems for developing optical fiber modules for use in datacom and telecomLed development of methodology for Micro-Vu 2D metrology OMM and the Zeta 3D profiler to screen parts for optical sub-assembliesReduced time required during production to screen parts by implementing a multiple-part screening procedure integrated with statistical process control (SPC)Identified and quantified flaws within part design that led to misalignments, especially at extreme temperatures

Applied organic chemistry and spectroscopy to flavor product development, primarily GC-MS characterization