Elvis Lim Email & Phone Number

Penang, Malaysia

Lead new product/package development & qualification in flip chip assembly process (FCBGA, MCM, FCLGA, FCPGA). Define and improve package requirement & assembly process flow definition, process characterization & optimization.

Penang, Malaysia

Qualify new product and manage manufacturing process related quality issue for Wafer bumping (ENIG NiAu/NiPdAu), wafer level packaging, PI lithography and Photoresist, electro-less plating, wafer thinning, sputtered back metal coating and dicing.

Bayan Lepas

• Led and enabling new supplier qualification, supplier process development, quality & process capability enhancement and capacity expansion for Flip Chip assembly material.
• Developing, qualifying & managing assembly direct materials (integrated head spreader) for Flip Chip IC Packaging and indirect materials (tray & cover tape).
• Collaborate within engineering teams to develop a commodity strategy and technology roadmap that aligns technology and business requirements to attain… Show more
• Collaborate within engineering teams to develop a commodity strategy and technology roadmap that aligns technology and business requirements to attain highest leverage and competitive position with suppliers of major.
• Drove competitive sourcing environment leading to continuous improvement in quality, cost, service and technology- Delivered yield improvement from below 90% to 93% via ultra-sonic cleaning and visual criteria.
• Experiences in developing stamping, Ni (electrolytic) & Au plating recipe with supplier for heat spreader packages.

Bayan Lepas

• Managing wafer dicing process and equipment using Laser technology used in Flip Chip assembly process and its associated yield & quality improvement.
• Driving key quality issue “non-wet” and die crack in die singulation process area.
• Process Control leader responsible to drive and outline key process control.
• Optimizing the process using systematical approach such as statistical method (DOE) and structure problem solving in die preparation area
• Well verse in… Show more
• Well verse in statistical Process Control method, JMP, Commonality analysis, basic JMP scripting Show less

Bayan Lepas

• Managing SMT LED (Light Emitting Diode) epoxy encapsulation process development, yield improvement, optimization and quality issue.
• Team leader for yield improvement (Successfully improve the casting yield from 83% to 95%) & perform product transfer
• Team leader and uncover the long outstanding problematic issue chip-epoxy delamination by introducing optimized curing process.
• Six sigma project team leader for resin usage optimization which has improved the… Show more
• Six sigma project team leader for resin usage optimization which has improved the wastage significantly.
• Successfully address customer complaints such as lifted glue issue which avoided few millions part return. Show less

Bayan Lepas

• Managing incoming material quality issue, new material qualification, working with supplier on cost reduction and dock to stock program.
• Managing quality issues for the in-line processes, outgoing quality, customer complaints and perform failure analysis on rejected products for integrated circuits assembly.

Ph.D In Material Engineering, Electronic Materials

Master Of Science (M.Sc.), Solid States Physics

Bachelor'S Degree, Material Science