Emanuel Caasi Email & Phone Number

Singapore, Singapore

• Perform failure analysis on customer returns, production / process rejects and reliability and engineering evaluation failures.• Perform destructive physical analysis to understand competitors’ packaging capabilities • Advise problem-solving team on appropriate failure analysis techniques and readiness to support new packages • Develop new FA capabilities/techniques to enhance detection capability or productivity or optimize recipes.• Improve package robustness through feedback of packaging issues to Packaging R&D for appropriate design changes. • Improve customer satisfaction through enhancing FA lab processes for robustness and improved cycle time• Drive improvement activities to improve on FA lab key indices in UTAC• Identify and implement cost reduction activities in the FA lab to reduce operations cost.• Conduct FA staff training on FA techniques and procedures.• Perform any other duties assigned by manager from time to time.

Malvar, Calabarzon, Philippines

. • Provided design input, validation plan, prototypes / testing, complete Engineering Change Order (ECO), drawings, datasheet and Failure Modes and Effects Analysis (FMEA) updates.• Ensured proper documentation of technical documents for assigned product• Lead sample production of new products • Conducted follow up on actions, product change notice (PCN), deviations with relevant departments to gather necessary data• Coordinated with relevant departments on testing, process and yield improvement • Participated, coordinated and ensured completion of quality related requirements of a product • Coordinated with supplier as technical liaison

Region Iva - Calabarzon, Philippines

• Interfaced with customer support engineers to obtain and understand information about the failure mode, and verify the failure.• Performed electrical debug and circuit analysis at module, package, and/or die level to establish failure mechanism and identify defects. This involves analysis of functional analysis, extensive analog and digital testing and analysis, as well as the use of electronic design automation (EDA) tools for layout and circuit analysis.• Managed physical failure analysis and defect identification at external and internal laboratories.• Provided analysis reports with defined conclusion.• Interfaced with Product Engineering, Design Engineering, Application Engineering, Customer Quality Engineering, Reliability Engineering and Wafer/Fab Engineering for various product quality related issues.• Handled multiple customer returns/issues at one time.• Managed analysis cycle time to meet customer expectations.• Supported field Quality Assurance (QA) engineers in a timely manner.• Performed bench analysis to replicate the Automated Test Equipment (ATE) test failures and customer reported failures.• Performed in-circuit microprobing to locate the failure.

Region Iva - Calabarzon, Philippines

• Ensured quality and completeness of all project specifications.• Drove yield improvement activities to reduce scrap loss for new products both Front end and Back end.• Drove test flow simplification activities for new products on number of inserts (Get-out-of Room, Get-out-of Hot or Get-out-of Cold), burn-in requirements (Get-out-of Burn in) and test time that will reduce overall test cost.• Executed Qualifications; Device quals, wafer level burn in (WLBI), Subcon quals, Fab quals, New package quals, New site quals, Class test at Sort (CTAS) quals, Class test at Class (CTAC) quals.• Maintained contact with the technical community with respect to product manufacturability, testing strategy and other developmental projects.• Ensured deliverables for the project is defined by the Product Management (PM)/ Product Line (PL) are complete.• Documented any barriers in completing a project and reports these barriers to the PM or PL of the project.• Documented activities and milestones of the projects assigned.• Executed activities and quals needed in the project.• Executed ATE and bench characterization activities as required by the project.• Characterizesd and understood defects needed to improve die and Back end yield.• Created and completed travelers, memos, specs, PSCN’s, MRB’s, SWR’s, manufacturing checklists.• Communicated project update to the team leader and management.• Completed system required information such as system readiness for new BE part.• Coordinated qual execution documentation and closure with Rel and QA.• Coordinated project requirements, such as Assy/ BI/ Test capacity, test vehicle lots and hardware with manufacturing.• Provided on schedule (OS) lots supplementary support as required.• Complied with the proper operating procedures of safety and health standards and regulations.• Verified and analyzed Return Merchandise Authorization (RMA) units.• Analyzed device functionality failures.