Hardware Engineering
CurrentDevelop Goodix's Tensilica DSP core and next generation TIE algorithm.
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Eric Xing is listed as Hardware Engineering at 汇顶科技, based in Shanghai, China. AeroLeads shows a matched LinkedIn profile for Eric Xing.
Eric Xing previously worked as Sr. Staff Hardware Engineer at 迈威迩 and Staff Hardware Engineer at 泰鼎. Eric Xing holds 硕士, 通信与信息系统 from 南京理工大学.
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Eric Xing is a Hardware Engineering at 汇顶科技.
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中国 上海市
Develop Goodix's Tensilica DSP core and next generation TIE algorithm.
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Eric Xing works for 汇顶科技.
Eric Xing is listed as Hardware Engineering at 汇顶科技.
Eric Xing is based in Shanghai, China while working with 汇顶科技.
Eric Xing has worked for 汇顶科技, 迈威迩, 泰鼎, and 环旭电子股份有限公司.
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Eric Xing holds 硕士, 通信与信息系统 from 南京理工大学.
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