Eric Yi Email & Phone Number

上海

Audio System expert:1. Lead the design of audio system hardware architecture. Including chip selection, audio system hardware block diagram design, circuit design review, etc2. Participate in the audio hardware schematic design & review for GWM V3.5 product. Including external DSP, power, SPI communication, I2C communication,TDM clock data, I2S clock data,SOC audio mclk,BT module,A2B,ADC,Amplifier,Tuner3. Lead the review of Product Requirement Documents4. Design audio system software architecture base on product requirements. Includes: Audio play and capture path architecture designAudio effect solution design: volume, fade in/out, mute, speed volume compensation, wind volume compensation, loudness compensation, GEQ, PEQ, DTS CSautoSa8155/Sa6155 ADSP topology design by using QACT, QXDM, QPSTQualcomm audio HAL audio path & control solution designQualcomm QNX audio CSD driver customizationQNX & Android Audio IPC Manager Module designAudio External DSP (AK7707) Control Engine software module design:SOC & external amplifier interaction solution (A2B & I2C)SOC & MCU interaction (SPI) Audio API designParticipate in A2B Amplifier I2C control solution designParticipate in Product End OF Line (EOL) Test’s Audio solutionParticipate in Audio Diagnose solutionParticipate in Audio Engineer mode solutionParticipate in Audio Power Mode Control solution, etc5. Participate in DAB hardware system solution design6. Research DAB software system architecture7. New board bring-up audio related, and help check HW issues8. Demo project support on Qualcomm Demo Board. Mainly including audio path development and debugging: Audio HAL, audio Kernel, QNX CSD audio system, external Audio DSP (NXP Mercury) configure9. Writing Technical & project managements DocumentsProjects:1. Android Q demo project of Great Wall IVI platform2. Design and development of Great Wall v3.5 projectKey word:Audio virtualization, QNX io-audio, QNX CSD, Linux ALSA, ADSP QACT, QXDM

上海

Audio expert, responsible for:1. Leader of audio team(2 man), responsible for new Car Intelligent Cockpit product's all audio related feature design and implement, task schedule, priority, contact and communicate with 3rd party supplier for entire audio system design.2. Familiar with Intel Ias audio Hal architecture.3. In Intel Audio HAL level, use SmartX framework to implement Speed Volume Compensation, Volume, Fade in/out, ALSA plug-in device. Very familiar with Intel SmartX.4. Skilfully use Intel Parameter Framework (PFW) to control audio effect modules, audio path, parameters, and effects.5. Add play and capture FE, BE in Intel ALSA platform driver for audio HIFI DSP.6. Add play & capture device in Intel ALSA machine driver7. design HIFI3 audio DSP topology，and TDM ssp blob configures8. Implement AK7739 ALSA codec driver, design ak7739 DSP1 & DSP2 topology, integrates HFP ECNR for HFP noise & echo reduction.9. Base on project requirements, design car audio routing architecture. Include Audio Hal, and SOC’s HIFI3 DSP, and EXT-ak7739 DSP, which is based on device, address, flag, criteria.10. Car audio effect implement in ak7739 DSP: fade, balance, mixer, EQ, loudness compensation.11. Car Audio control interface design and implement, to let Android CarAudioService control low level audio effect.12. Participate in design Car Audio source switch logic, and volume duck logic in Android Car audio manager.13. Design & implement Voice recognition audio path design, which base on Android audio recorder.14. Familiar with Android audio focus control policy15. Familiar with Android audio device policy.16. Familiar with Android audio framework.17. Familiar with Android HAL interface HIDL design.18. Familiar with Binder19. Can modify sepolicy to fix audio priority issue20. very good on gdb debug.

Shanghai

Work in audio team of the Video Department, expert of audio related.Senior Software Engineer, responsible for:•In new AMP system architecture design and develop project, proposal and review solutions for audio decoder module, post processor module, and audio output system architecture design.•Developed many types of audio decoders for Smart TV and STB, include DCV/AAC/AC3/MP3/WMA/Real Audio/AMR..., which are running on ZSP and ARM.•New generation chips' audio related software modules bring up on both FPGA and chips, include: BG2Q, BG4CDP, BG4CT, BG4DTV.•New audio features design, include: Audio Description, IP control system, data pack for SPDIF,audio encoder module...•Optimize logics, and improve AMP system's audio part stability and efficiency, such as: low latency audio, share memory data cache coherence, multi-streams playback zapping and performance improvement, AV sync logic...•Trace and fix issues when doing audio system certification: Dolby certification, Netflix NTS and Google CTS tests.•Fix customer audio bugs and improve code quality, help products MP.Software environment: C, C++, ASM, python, shell script; AMP, LINUXZView compiler and debugger, GCC, GDB.Hardware environment: ARM, ZSP800My Main Contributions for Marvell:1.Proposal and review solutions for AMP audio system architecture design. Which help made AMP architecture have good compatibility with different modern middleware (such as GStreamer, OpenMAX), and easy to extend for new use cases.2.Fast bring up and validate lots of Marvell new generation chips' audio related SW/HW functions, which help new chip deliver to product development earlier, so deliver to customer earlier.3.Integrating and porting many third party audio decoders in both ARM and ZSP, which made audio system have good capability to meet customers' demand. 4.Improve audio system stability and code quality and add new audio feature for customers, to make audio system feasible for different customers' products.

上海

Application Engineer , expert of audio relatedSoftware environment:c , FAMOS / LINUX OS. Realview compiler and debugger, GCC, GDB.Hardware environment: ARM11, ARC700Introduction: There are 3 CPU in our Set Top Box chip, video decoder, ARC700 for audio decode, ARM11 for main application and control other CPU. The official release is first on FAMOS OS which is an easier OS written by Japan colleague, then apply them to Linux version.Responsible for·Support solution team in audio related.·1.Audio decoder (HEAAC/AC3/MPEG) maintains, which is running on ARC processor.·2.Audio abstract level , output driver, decoder driver, sync driver development and maintains on FAMOS and Linux OS.·3.Audio mix related development and performance improvement.My Main Contributions for Fujitsu:1.Integrate free third party MP3 decoder(lib MAD) in ARM application.2.mixer system:a. Written a software mixer, which can mix multiple decoders'output data.b. Develop related application, abstract level lib, driver.c. Improve decoders and driver’s performance by optimise code , utilize data cache, SRAM, optimise compiler configuration, when decoder accessing data.3.Improve audio and video synchronization method on MPEG/AAC audio decoder, by calculate the accurate present time of first frame audio data. And which is more complicated in a system with mixer.

Senior Electronic Engineer·Responsible for·1.Audio IC application solution design, such as electronic keyboard , digital piano etc.·2.In charge of testing new IC on FPGA, and developing driver. participated in new IC design.·3.In charge of effect system design ,and write audio signal processing algorithms .Main contribution for Medeli:Project Title: MX5010 audio codec control system design 2010.8~2010.9 Project Title: Double A2 system bring up 2010.3~2010.8Project Title: A3 chip debug system design 2009.10~2010.3Project Title: A2 chip insert effect system design 2009.3~2009.9Project Title: 2032A chip Test and Sound Generation Driver design 2008.5~2009.2Project Title: M1000 chip's Sound Generation Driver 2007.12~2008.4Project Title: DP268 DIGITAL PIANO product development. 2007/01 -- 2007/07Project Title: DP368 DIGITAL PIANO product development. 2006/07 -- 2007/01

Master'S Degree, Integrated Circuit Design

Bs, Electronic Information Engineering