Staff Package Design Engineer
Current-Define, develop, and implement thermal analysis methodology for complete company product portfolio-Drive high-speed datacenter interconnect, high performance analog, and commercial/industrial spec wireless product thermal design process using ANSYS Icepak & customized calculation tools at transistor, die, package, and system levels-Concisely communicate relevant, actionable thermal recommendations to appropriate stakeholders-Lead, mentor and develop skills of thermal team; prioritize and delegate tasks to team members-Establish and manage thermal project deadlines; communicate progress to management-Cross-train individuals and teams to equip them with necessary thermal knowledge to effectively support internal and external customers
Jan 2022 - Present
