Mechanically architected and developed FlashBlade//S, a next-generation, modular, all-flash storage blade system (ground-up redesign).

• Developed and brought to market a next-generation all-flash storage modular blade product.• Established tools and infrastructure for Mechanical Engineering Team, mentored NCG/junior engineers, and served as BU subject-matter expert.

Lead and drove the development of cutting-edge, high-volume, cost-effective server products for the Data Center space while operating in a fast-paced, startup-like environment.• Architected & developed (mechanically) the "C480 ML M5" 4U ML/AI Appliance• Co-developed and brought to market the "C480 M5" 4U Rack Server• Architected & developed the "B260/B460 M4 v4" line of Blade Servers

Lead and drive the development of cutting-edge, high-volume, cost-effective server products for the Data Center space while operating is a fast-paced, startup-like environment. • Develop and support, across multiple business units, products from initial concept through end-of-life.• Drive, as a leader in a cross-functional team, an integrated design approach, balancing electrical, mechanical, thermal, manufacturing, cost, quality, and cosmetic considerations.• Execute detailed design of rack and blade systems,including sheet metal parts, plastic parts, power supplies, and fan trays.+ Developed multiple thermal and mechanical sub-systems of the UCS C460 M4 Rack Server

Lead the design and development of cost-effective, high performance mechanical-thermal solutions for GPU- and SoC-based graphic and compute products while working in an exceptionally dynamic, fast-paced environment• Drive, as a leader in a cross-functional team, an integrated design approach balancing electrical, mechanical, thermal, manufacturing, cost, quality, and cosmetic considerations.• Develop and support products across multiple business units, including but not limited to Gaming, Compute, and Automotive (Cluster and Infotainment).• Direct a multi-national manufacturing team of vendors and internal personnel in the evaluation and production of high-quality mechanical-thermal solutions• Develop and maintain tools and procedures for increased quality and consistency of design + Developed the mechanical/thermal/cosmetic solution for both the GTX295 dual-PCB and single-PCB products, the "Highest Performance Graphics Card " at the time of release+ Developed the mechanical/thermal/cosmetic solution for the GTX480 product, the "Highest Performance Single-GPU Graphics Card" at the time of release+ Promoted to an IC4 (Individual Contributor Level 4) in October 2009+ Served as a company representative to the Peripheral Component Interconnect Special Interest Group (PCI-SIG), co-authoring the r3.0 PCI Express Card Electromechanical Specification+ Developed new subcomponent systems used in the GTX680 product, the "Highest Performance Single-GPU Graphics Card" at the time of release

Lead the design and development of cost-effective, high performance cooling solutions for the electronics industry • Analyzed customer requirements and guided or completed the design of solutions to effectively meet or exceed those requirements in a timely manner, with specific emphasis on design for manufacturability• Guided a multi-national manufacturing team in the production and evaluation of cooling solutions while coordinating the daily activities of a local team of 2-3 engineers• Developed and maintained customer and supplier technical relationships+ Designed a high performance, lightweight, passive cooling solution for the 3000 Series Multi-Core Xeon® Processor, resulting in the group’s first listing as an Intel “reference design”+ Secured the group’s most substantial business to date by developing a cost-effective cooling solution for the Microsoft XBOX360™ Gaming Console and coordinating the efforts of a multi-national manufacturing team to debug, approve, and release the product on an expedited timetable

Performed and lead the design and development of cost-effective cooling solutions for the electronics industry • Analyzed customer requirements and completed the design of solutions to effectively meet those requirements in a timely manner, with specific emphasis on design for manufacturability• Created test fixtures and methods for the evaluation of new design concepts• Provided on-site technical support at customer locations+ Secured the group’s most significant business to date by designing a cost-effective, high-performance, system-level cooling solution for the Hewlett-Packard Company and guiding the efforts of a multi-national manufacturing team to release the product on an accelerated timetable+ Developed a patented mechanical retention system for cooling solutions+ Presented with Molex’s 2004 Presidential Award for extraordinary performance+ Promoted to Engineering Supervisor in December 2004

Designed, developed, and implemented into production cooling solutions that met or exceeded customer expectations • Minimized risk areas in proposed designs, implementing proven methods and means to solve potential manufacturing, packaging, processing, and ergonomic issues• Performed product testing and evaluation+ Designed and coordinated the construction of production-quality prototypes in a period of 5 business days+ Developed a complete product family of cooling solutions for desktop AMD Athlon XP Processors that required twenty different variations in order to accommodate the broad specifications of the end-user+ Promoted to Project Engineer in April 2003

Designed, developed, and implemented into production connector products that met or exceeded customer expectations• Minimized risk areas in proposed designs, implementing proven methods and means to solve potential manufacturing, packaging, processing, and ergonomic issues.+ Modified the design of an existing, high-volume product to eliminate reliability issues and simplify its assembly process while minimizing any associated tooling costs+ Secured a 100% allocation for a connector product at the Compaq Computer Corporation by coordinating and executing a prototype build on an expedited timetable with limited resources+ Transferred to the Thermal Products Group per the recommendations of the Divisional Engineering Director

Designed and developed new products, supported existing product lines, and provided technical support to manufacturing facilities• Provided on-site technical support at customer locations+ Developed a low-profile connector product that secured the corporation’s most significant business to date in the wireless telephone market+ Retained a 12 million dollar per year account by working with a multi-national design team to analyze and eliminate failures with a product line for Sun Microsystems Incorporated

Developed new products and supported existing product lines as dictated by rotation guidelines• Developed a fundamental knowledge of the capabilities and limitations surrounding the skiving, stamping, and plating of metals, the extrusion of polymers, and the use of automatic assembly equipment+ Coordinated the rapid execution of product testing to save a key customer account with the Sony Corporation and displace a competitor’s product+ Presented with a Spot Bonus Award for “responsive and dedicated efforts in bringing the Straddlemount 1mm Connector Product and Application Tooling to market” for the Compaq Computer Corporation