Eric Wan Email & Phone Number

Greensboro, Nc, Us

Oo

Oo

• Leading a mechanical design team at Global Advanced Test Engineering, providing NPI mechanical testing solutions for high volume production testing of RF modules of Power Amplifiers, Switches, Filters, PMIC, ETIC etc.• Managing a variety of engineering functions including innovation, design, fit and form, document control, and similar engineering support activities.• Providing directions for the test fixture design team.• Guiding test sockets and change kits design activities and developing socket and contact technology to adapt to cutting edge packaging technology, i.e. smaller pitch, smaller pads, higher current, RF impedance match, etc.• Supporting Test Engineering and OSAT subcontractor by investigating and resolving test / contact related issues in high volume semiconductor testing.• Working with global suppliers on developing the latest and customized contact solutions with best material interface performance.• Utilizing various programs to develop efficiency and standard design tools with scripting. • Mentoring and coaching engineers to accomplish new tasks and to the next level. Evaluating subordinates’ performance and supporting their career path development.• Provided technical support for thin die/module cracking issues.

Oo

Same as serviced in RFMD.

Review technical Papers

Greensboro, Nc, Us

• Extensively explored the thermal characteristics of Si-GaAs hybrid epoxied die stacking, analyzed combined heat spreading effect of die attach, silicon die and copper pillars, presented findings at RFMD Tech Summit 2013, accepted by SemiTherm 2014.• Successfully captured the thermal characteristics of complicated CMOS PA with hundreds of PA cells. Analyzed and categorized heat loss efficiency of each individual copper pillars and provided guidelines to IC designers, which leads to optimized signal routing and copper pillar arrangement that significantly lowered junction temperature. • Led research of the impact of backend topology and power dissipation distribution on accurate prediction of junction temperature and reliability life of FET devices. Presented findings at iMAPS 2012.• Led the thermal management of flip chip and copper pillar SiGe PA die/package design and optimization. Provided accurate prediction of electro-migration and first failure location on base fingers to the reliability group. Presented complete analysis and solution at RFMD Tech Summit 2012.• Led the research of thermal optimization of WLFO (wafer level fan out) / RDL (redistribution) package design as part of package shrinkage/thinning and performance enhancement project.• Working closely with IC device engineering to support the coupled IC-Thermal Simulator, which could eventually provide most realistic RF out and heat generation from each individual PA cells. • Working on generic ANSYS models for IC packages and motherboard, that maintain both realistic irregular geometry, convenient user input and minimum coding.• Evaluated and optimized laminate/substrate/leadframe, die attach/solder/thermal grease, and evaluation/user board for various packages. Correlated with IR infrared imaging results. • Worked closely with IC design, packaging design, fab, assembly, reliability, testing groups and venders/customers from concept to mass production.

Tempe, Arizona, Us

o Led thermal characterization research on high density package/die stacking needed in next generation consumer products. Critical in leading effort to reduce the size and cost of electronic packages for a particular style of packages.o Developed methods for predicting the thermal performance of heat sinks using a novel modeling approach. Results from these studies will allow to better serve customers by providing characterization data for their packages under realistic operating conditions. The benefit is a savings in manpower of approximately 50%.o Provide thermal management and optimization of advanced electronic packaging by CFD modeling and thermal experimenting. o Develop thermal simulation and experimental test method. Perform thermal experimental measurement and perform thermal characterization of packages.o Design and develop thermal test hardware and PCB. Work closely with R&D and production on making thermal test vehicles.o Support customer on specific packaging requirement. Provide expert thermal advice throughout product development stages.

Austin, Texas, Us

• Led and provided thermal research, design and evaluation on next generation rack mount and pole mount high power microwave radios by analytical methods and creating thermal models and simulating in Flotherm, Icepak and CosmosWorks software.• Designed heatsinks and cold plates with heatpipes to minimize the thermal resistance from chip junction to the ambient air. Expert on thermal interface material and fan selection to meet thermal and performance requirement. Kept track of the cutting edge cooling technologies by journals, conferences and forums.• Led and performed thermal experiments in both module and system levels, using infrared camera and thermocouples. Optimized thermal design and defined product specification.• Provided mechanical design of indoors and outdoors microwave radios and RF/digital modules from concept to production, considering cost, geometric tolerance, throughout design. • Worked closely with management, RF, digital, documentation, component, test, production teams on thermal/mechanical design and selection/customization of off-the-shelf parts.• Created 3D models and 2D drawings for industrial parts and assemblies using Pro/Engineer, Solidworks and AutoCAD. Professional documentation for production.

Melbourne, Florida, Us

Same as above.

Us

• Developed accounting systems for clients and an administration system of airplane parts.• Developed accounting systems for small businesses according to their unique demands.

Us

• Participated in the medium chiller technology transfer from TRANE Co. Ltd. (USA).• Designed production lines for the medium chiller by Demand Flow Technology.• Developed a Bill of Material administration system for the medium chiller system.

Phd, Heat Transfer And Fluid Mechanics, Minor Ee: Ic Fabrication

Master Of Business Administration (Mba)

Ms, Fluid Mechanics

Bs, Thermophysics