Ethan L. Email & Phone Number
@qualcomm.com
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Who is Ethan L.? Overview
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Ethan L. is listed as Principal Engineer at Qualcomm at Qualcomm, based in Douglas County, Colorado, United States. AeroLeads shows a work email signal at qualcomm.com and a matched LinkedIn profile for Ethan L..
Ethan L. previously worked as Principal Engineer at Qualcomm and Engineer at Lockheed Martin. Ethan L. holds Phd, Materials Physics from University Of Oslo.
Email format at Qualcomm
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AeroLeads found 1 current-domain work email signal for Ethan L.. Compare company email patterns before reaching out.
About Ethan L.
Semiconductor professional since 1998. PhD:Materials Physics, MSc:EE, BSc:PhysicsProfessional/academic work with: NXP, Texas Instruments, LSI Logic, Hyundai (Hynix), Univ. of Oslo, Portland State Univ., Willamette Univ.International experience in Norway, France, South Africa, USA (US citizen).I have experience with:Photonic Integrated Circuit design - designed and taped out RF photonic transceiver and silicon line width process monitor as part of MITx (edX) course. (experience with RSoft, Sentaurus, Lumerical)Si-CMOS SOCs, ASICs, & DRAM in 220, 180, 120, 90, 65 nm technologies in 200 & 300 mm fabs.Research in IV-IV and II-VI compound semiconductors at MiNaLab - SMN - UiO.Research in digital test methodologies and defect mechanisms in both industrial and academic settings.First silicon and new product debug and characterization.Design for Test / Manufacturing (DfT / DfM) principles (ATPG, stuck-at, delay fault, Iddq, MBIST, LBIST).Yield enhancement & Scribe line parametric test.Electrical and physical failure analysis and characterization.Various ATE and metrology equipment Advantest, Credence, VLCT, XRD, ellipsometry, SEM, etc.
Listed skills include Semiconductors, Silicon, Characterization, Failure Analysis, and 25 others.
Ethan L.'s current company
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Ethan L. work experience
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Engineer
Advocate for device/component traceability throughout the electronics supply chainStudy potential of ECID, PUF, mapping, and other technologies for enhancing SECURITY & TRUST in the semiconductor supply chainSupport designers and subcontractors with EEE component selection for use on a high reliability program
Sr Principal Test/Product Engineer
Test & product engineering for mixed signal IC's.Collaboration with design, bench test, quality, marketing engineers, and vendors for New Product Introductions (NPI). - Hardware and software development (with Advantest 93k test platform). - Work with design team to ensure DFT (design for test) is implemented and cost effective. - Debug IC design and test.
Board Member
Norwegian PhD Network on Nanotechnology for Microsystems
Phd Candidate
Compound Semiconductors - Ceramics - Oxides - Thin FilmsNanostructuring SiGeTransparent oxide transistors with ZnO channelsLi diffusion in thin films of MOCVD grown ZnOInvesitgated the oxidation induced formation of heterostructures in epitaxial SiGe on Si substrates.- Constructed empiric models to describe the redistribution of Ge during oxidation.- X-Ray.
Test Engineer
Technology – 180nm Radio Frequency (RF) / Low Power Wireless System On Chip (SoC) designsDevelopment and execution of test strategy for new product introductions.- Write code for production and characterization test programs.- Design and order final test load board, HTOL test (aka lifetime reliability test) board, and wafer test probe card..
Ip Test Engineer
Technology – 65nm, 90nm, & 120nm Digital SoC’s – 300mm fabNXP fab interface team at ST-Freescale-NXP collaboration fab in Crolles, France.- Provide test support to NXP business groups for new product introductions and first silicon debugs.- Yield enhancement for NXP products produced in the ST-Freescale-NXP collaboration fab.- Development and execution of.
Research Assistant
Technology - 120nm & 180nm Application Specific Integrated Circuits (ASICs)Conducted research in testing of digital integrated circuits in the IC Design and Test Laboratory at Portland State University in cooperation with LSI Logic.- Digital IC test research focusing on temperature sensitive defects, minimum voltage (minVDD or VDDmin) and maximum frequency.
Integrated Yield Management
Technology - 120nm & 180nm ASIC’s – 200mm fabProduction line yield enhancement.- Daily monitoring of wafer level product and scribe line parametric test data.- Data and failure analysis to determine root causes for maverick and low yield product.- Individual and team work to identify and rectify systematic yield issues including process marginalities.
Process Integration Engineer
Technology - 220nm Synchronous DRAM – 200mm fabManagement of Electrical Parametic Measurement (EPM) section. (aka Process Control Monitor (PCM) or scribe line test section)- Code management for Keithley based EPM test programs.- Integration of new products and technology generations for EPM department.- Production line yield enhancement- Gather, prepare.
Ethan L. education
Phd, Materials Physics
Msc, Ee
Bs, Physics
Physics & History
Frequently asked questions about Ethan L.
Quick answers generated from the profile data available on this page.
What company does Ethan L. work for?
Ethan L. works for Qualcomm.
What is Ethan L.'s role at Qualcomm?
Ethan L. is listed as Principal Engineer at Qualcomm at Qualcomm.
What is Ethan L.'s email address?
AeroLeads has found 1 work email signal at @qualcomm.com for Ethan L. at Qualcomm.
Where is Ethan L. based?
Ethan L. is based in Douglas County, Colorado, United States while working with Qualcomm.
What companies has Ethan L. worked for?
Ethan L. has worked for Qualcomm, Lockheed Martin, Nxp Semiconductors, Nano-Network, and University Of Oslo - Center For Materials Science And Nanotechnology (Smn.Uio.No).
How can I contact Ethan L.?
You can use AeroLeads to view verified contact signals for Ethan L. at Qualcomm, including work email, phone, and LinkedIn data when available.
What schools did Ethan L. attend?
Ethan L. holds Phd, Materials Physics from University Of Oslo.
What skills is Ethan L. known for?
Ethan L. is listed with skills including Semiconductors, Silicon, Characterization, Failure Analysis, Thin Films, Cmos, Ic, and Nanotechnology.
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