Frank Fan Email & Phone Number

Shen Zhen

Product Engineering Team - Amazon Hardware and Devices.

Shen Zhen

Shenzhen, Guangdong, China

1. Mechanical Design for CEPE products.2. Take responsibility from structural design, prototyping, testing and verification, until product Alpha, Beat & Mass Production.3. CAD data (3D and 2D) release and BOM management.4. Others.

Shen Zhen

1. Mechanical Design for HED products.2. Take responsibility from structural design, prototyping, testing and verification, until product Alpha, Beat & Mass Production.3. CAD data (3D and 2D) release and BOM management.4. Others.

Singapore

Project 1: 3D SPI Ver. #2 Development1. Mechanical Design Leader for 3D SPI Core Module - Optics (Imaging Module + 2 Side DLP Projectors). 2. Tooling & Jig design for assembly, Test Bench design for module testing.3. Production support (DFM, DFA, etc.), creating WI / Check List, etc.4. Guidance for junior engineers for detail design, 2D drawing creation &.

Singapore

1. A team with 3 engineers, working on the continuous improvement of SMT Screen Printer;2. Cooperation with SiPlace, on the project schedule for mahcine Alpha and Beta Test;3. Acquire customer feedbacks on the mahcine usage & issues collection, arrange the team to work on solutions, and do updating for the field machines; 4. Coordination work between.

Singapore

1. Anticipation in full cycle from design to production: information collection,conceptual design, caculation & detail design, prototyping, assembly, testing & verification, continuous improvement, process study, document preparation for production, standarzation of volumn production process, establishment of qualification system, jig & fixture design.

Singapore

Responsible for new products design and development, including information collection and study, conceptual design, detail design, testing, continuous improvement, process study and process improvement, etc. Familiar with smt/semiconductor/micro-electronics/solar/wafer related industries, equipments and production lines, and processes as well. Well know.

Hang Zhou

3D Modeling Engineer (Internship), Mold Modeling & Reverse Engineering.

Master, Mechanical Engineering, 10.4/12.0

Activities and Societies: Research on Thermosonic Copper Wire Bonding Process- Project: Finite Element Analysis of Thermosonic Copper Wire.

Bachelor, Mechanical Engineering, 3.9/4.0

Activities and Societies: 1.Robot Design Competition; 2.UCLA Exchange; 3.Mechanical Design Training; 4.Industrial Training; 5.UG NX.

Exchange Program, Exchange Program, 4.0

Activities and Societies: Exchange ProgramExchange Program