Frank Fan Email & Phone Number

Shen Zhen

Product Engineering Team - Amazon Hardware and Devices.

Shen Zhen

Shenzhen, Guangdong, China

1. Mechanical Design for CEPE products.2. Take responsibility from structural design, prototyping, testing and verification , until product Alpha, Beat & Mass Production.3. CAD data (3D and 2D) release and BOM management.4. Others.

Shen Zhen

1. Mechanical Design for HED products.2. Take responsibility from structural design, prototyping, testing and verification , until product Alpha, Beat & Mass Production.3. CAD data (3D and 2D) release and BOM management.4. Others.

Singapore

Project 1: 3D SPI Ver. #2 Development1. Mechanical Design Leader for 3D SPI Core Module - Optics (Imaging Module + 2 Side DLP Projectors). 2. Tooling & Jig design for assembly, Test Bench design for module testing.3. Production support (DFM, DFA, etc.), creating WI / Check List, etc.4. Guidance for junior engineers for detail design, 2D drawing creation & BOM creation, etc.5. Coordination among ASM Singapore & ASM Cheng Du, ASM Shenzhen, ASM Huizhou, etc., work closely with SiPlace team (process, system integration, PM, etc.).6. Optics Module testing & validation work for both offline & online.Project 2: Development of Laser Cutter Machine (VIM downstream machine used in IC backend packaging line)1. In charge of the Laser Head Suction Nozzle Design for the laser-cutting-process-generated particles handling.2. Proposal of different ideas to fulfill the suction nozzle functionality requirement & size limitation. 3. Work closely with CAE team on CFD (particle suction path & suction efficiency, etc.), to optimize the inner flow path design for the nozzle.4. Concept verification using 3D-Printed Mockup (Stratasys): 3D printing, module assembly, experiment design & setup in lab; The testing results can be used as input to own design team & CAE team for further optimization.5. Nozzle & Laser Head integration, and the whole module integrated into the whole laser cut machine with other ME team members.

Singapore

1. A team with 3 engineers, working on the continuous improvement of SMT Screen Printer;2. Cooperation with SiPlace, on the project schedule for mahcine Alpha and Beta Test;3. Acquire customer feedbacks on the mahcine usage & issues collection, arrange the team to work on solutions, and do updating for the field machines; 4. Coordination work between design team, software team, electrical team, process team and in-house production team, QC team, etc.;5. Improvement of machine production efficiency & quality system;6. Vendor sourcing for lower cost but equivalent quality & performance purchasing parts and component;7. BOM management & design change control;8. Project schedule control & resources management.

Singapore

1. Anticipation in full cycle from design to production: information collection,conceptual design, caculation & detail design, prototyping, assembly, testing & verification, continuous improvement, process study, document preparation for production, standarzation of volumn production process, establishment of qualification system, jig & fixture design, providing training to operators &customers, etc.;2. Major design work: overall system design to integrate mechanical module, framework and cover, electrical hardware, software, testing station & jigs, etc.;3. Design work covered: mechanical parts (structural, mechanism, dimension & tolerances, system frequency & isolation, etc.), electrilcal system layout (controller, power supply, PC, relays, cabling and wiring, etc.), pneumatic system (cylinders, solenoid valves, flow distributing boards, pnematic fingers, tubings, etc.), vacuum system (vacuum pump, vacuum generator, vacuum hose, etc.) and optical system (design mechanical parts & adjustment mechanism for optics), linear motor design, air bearing design, etc.;4. Design for manufacturing and design for cost;5. Machine accuracy & repeatability test: design of testing and calibration stations and jigs, data collection & analysis, design improvement, etc.;6. Printing porcess study & optimization: D.O.E. & SPC;7. Design of Advanced Features for Generation II Machine.

Singapore

Responsible for new products design and development, including information collection and study, conceptual design, detail design, testing, continuous improvement, process study and process improvement, etc. Familiar with smt/semiconductor/micro-electronics/solar/wafer related industries, equipments and production lines, and processes as well. Well know about vendors of actuators/sensors/motors/etc., and know how to size, select, and integrate them into design.

Hang Zhou

3D Modeling Engineer (Internship), Mold Modeling & Reverse Engineering.

Master, Mechanical Engineering, 10.4/12.0

Activities and Societies: Research on Thermosonic Copper Wire Bonding Process- Project: Finite Element Analysis of Thermosonic Copper Wire.

Bachelor, Mechanical Engineering, 3.9/4.0

Activities and Societies: 1.Robot Design Competition; 2.UCLA Exchange; 3.Mechanical Design Training; 4.Industrial Training; 5.UG NX.

Exchange Program, Exchange Program, 4.0

Activities and Societies: Exchange ProgramExchange Program