Pakistan Telecommunication Company Limited (PTCL)(PMO Department)During my tenure at PTCL Head Office in Islamabad, I had the opportunity to work extensively with GPON (Giga Passive Optical Networks) services, which provided me with a valuable learning experience. I gained knowledge about various concepts related to GPON, such as OLTs (Optical Line Terminals), FDH (Fiber Distribution Hub), splitters, feeder cables, drop cables, ONT (Optical Network Terminal), ODN (Optical Distribution Network) design. Additionally, I familiarized myself with different vendors operating in this domain.In the capacity of working in the Project Management Office (PMO), I had specific responsibilities to fulfill. One of my key tasks was to update the tracker, which involved gathering information from site engineers regarding the progress and status of various sites. Another important aspect of my role was issuing bulletins. These bulletins served as official communication channels through which important information, updates, and instructions were shared with the relevant teams. By effectively managing and distributing these bulletins, I played a crucial role in facilitating smooth communication and coordination among different stakeholders.Working at PTCL Head Office in Islamabad provided me with a valuable professional experience in the field of GPON services and Project Management.

Internship at National Institute of Electronics (NIE)During my internship at the National Institute of Electronics (NIE), I had the privilege of working on projects for their esteemed clients. This experience provided me with a comprehensive understanding of the complete process of PCB fabrication.Key Responsibilities and Achievements:1. PCB Design and Fabrication Process: During my internship, I actively participated in the PCB design and fabrication process. I collaborated with a team of experienced engineers to create schematic designs and convert them into functional PCB layouts. I gained expertise in using industry-standard software and tools for designing complex circuit boards. 2. CNC Drilling and Routing Process: As part of my internship, I had the opportunity to work with CNC (Computer Numerical Control) drilling and routing machines. 3. Lamination and Development Process: Another significant aspect of my internship was gaining knowledge about the lamination and development process involved in PCB fabrication. I learned about different lamination techniques, including dry film and liquid photoimageable (LPI) solder mask, and their applications. I also became familiar with the process of developing the PCBs through various chemical etching methods, ensuring high-quality and reliable circuitry.Throughout my internship at NIE, I demonstrated strong teamwork, adaptability, and problem-solving skills. I actively contributed to project deliverables and effectively communicated with team members and clients to ensure successful outcomes. This experience not only expanded my technical knowledge but also enhanced my ability to work in a fast-paced and dynamic environment.