With a Bachelor's degree in Mechanical and Manufacturing Engineering from University Malaysia Sarawak, I joined Intel Corporation as a Product Development Engineer in 2017. There, I collaborated with cross-functional teams to continuously improve processes and procedures, and improve product yield performance by implementing continuous improvement projects.In 2023, I became a Yield and Integration Engineer at GlobalFoundries, where I apply my data analytics and defect management skills to optimize the wafer fabrication process and ensure product quality and reliability by partnership with PI & process module owners to rectify baseline random defects. I am motivated by challenges and opportunities to learn and grow, and I value teamwork and innovation.