Francisco Daniel Ledesma
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Francisco Daniel Ledesma Email & Phone Number

Research Associate at University of Stuttgart
Location: Argentina, Argentina, Argentina 5 work roles 2 schools
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Current company
Role
Research Associate
Location
Argentina, Argentina, Argentina
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Francisco Daniel Ledesma is listed as Research Associate at University of Stuttgart, a company with 1514 employees, based in Argentina, Argentina, Argentina. AeroLeads shows a matched LinkedIn profile for Francisco Daniel Ledesma.

Francisco Daniel Ledesma previously worked as Mixed Signal Design Verification Engineer at Allegro Microsystems and Test Engineering Intern at Allegro Microsystems. Francisco Daniel Ledesma holds Engineer'S Degree, Electrical And Electronics Engineering - Signal Processing from Instituto Tecnológico De Buenos Aires.

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University of Stuttgart

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About Francisco Daniel Ledesma

As a Mixed-Signal Design Verification Engineer, my expertise lies in developing robust test cases using SystemVerilog, crafting precise models with VerilogAMS and VerilogA, and leveraging Cadence tools for comprehensive mixed-signal simulations. My experience also includes circuit simulation and modeling, particularly in the context of SPICE simulations.During my internship in test engineering, I gained hands-on experience working with Automated Test Equipment (ATE) and in lab environments, where I honed my debugging skills at the wafer level, including microprobing, and used Python for signal processing tasks. Additionally, I stay connected with academia as a graduate teaching assistant in Analog Electronics, where I teach and guide students through key concepts in solid-state physics, semiconductors, single-stage and multistage amplifiers, current sources, differential amplifiers, frequency response, and output stages.As an electronics engineer, I also have experience in layout design, utilizing tools for Layout vs. Schematic (LVS) and Design Rule Check (DRC) verifications, which I gained through dedicated coursework. For my final project, I developed a Transmission Line Pulse (TLP) Tester, a tool that was recognized as the Best Final Project. This project involved characterizing the dynamic response of electrostatic discharge (ESD) protection structures, providing valuable insights into ESD robustness at both the wafer and encapsulated levels.I am eager to transition into an Analog IC Design role within the semiconductor industry, where I can leverage my technical background to contribute to the development of reliable and efficient circuits.

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University of Stuttgart
University Of Stuttgart
Research Associate
Stuttgart, BW, DE
Employees
1514
AeroLeads page
5 roles

Francisco Daniel Ledesma work experience

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Mixed Signal Design Verification Engineer

Current

Argentina

Modeling and Simulation: Designed and verified VerilogAMS models based on schematics and specifications, ensuring accurate representation of analog and mixed-signal blocks in the simulation environment.Testbench Development: Developed and maintained testbenches for mixed-signal verification using SystemVerilog, enabling efficient and comprehensive testing.

May 2023 - Present

Test Engineering Intern

Argentina

  • Programmed analog and digital equipment, including Automated Test Equipment (ATE) and ETS88.
  • Utilized oscilloscopes, FPGAs, voltage/current sources, multimeters, and ovens for data gathering and analysis.
  • Automated tasks using Python and C/C++.
  • Documented measurement procedures and maintained version control using GIT.
May 2022 - Apr 2023

Graduate Teaching Assistant

Current

Buenos Aires Province, Argentina

  • Teaching Assistant in "Analog Electronics"
  • Conducted weekly exercises and graded practical assignments.
  • Provided support in solid-state physics and semiconductor topics.
  • Taught single-stage and multistage amplifiers, current sources, differential amplifiers, frequency response, and output stages.
  • Developed and delivered both theoretical and practical classes in Analog Electronics, in both Spanish and English, ensuring students understood key concepts and applications.
  • Evaluated student performance through practical assignments, exams, and assessments, providing constructive feedback to enhance learning outcomes.
Aug 2023 - Present

Electronics Technician

Mya Soft

Buenos Aires, Argentina

Fixing switching power supply, audio amplifiers and computers

Jul 2016 - Dec 2017
Team & coworkers

Colleagues at University of Stuttgart

Other employees you can reach at allegromicro.com. View company contacts for 1514 employees →

2 education records

Francisco Daniel Ledesma education

Engineer'S Degree, Electrical And Electronics Engineering - Signal Processing

Activities and Societies: IEEE-ITBA Student ChapterBest Final Project Award in Electronic Engineering (Jul 2023) Undergraduate Teaching.

Electronics Technician, Electrical/Electronics Equipment Installation And Repair, General

Instituto La Salle Florida

Activities and Societies: Robotics group

FAQ

Frequently asked questions about Francisco Daniel Ledesma

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What company does Francisco Daniel Ledesma work for?

Francisco Daniel Ledesma works for University of Stuttgart.

What is Francisco Daniel Ledesma's role at University of Stuttgart?

Francisco Daniel Ledesma is listed as Research Associate at University of Stuttgart.

Where is Francisco Daniel Ledesma based?

Francisco Daniel Ledesma is based in Argentina, Argentina, Argentina while working with University of Stuttgart.

What companies has Francisco Daniel Ledesma worked for?

Francisco Daniel Ledesma has worked for University Of Stuttgart, Allegro Microsystems, Instituto Tecnológico De Buenos Aires, and Mya Soft.

Who are Francisco Daniel Ledesma's colleagues at University of Stuttgart?

Francisco Daniel Ledesma's colleagues at University of Stuttgart include Reuben Lagahit, Catherine Bongcayao, Mariphen Villegas, Raquel Vinas, and Christian Ramas.

How can I contact Francisco Daniel Ledesma?

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What schools did Francisco Daniel Ledesma attend?

Francisco Daniel Ledesma holds Engineer'S Degree, Electrical And Electronics Engineering - Signal Processing from Instituto Tecnológico De Buenos Aires.

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