On Site Engineering, Operations and Lean Manager working physically inside Cal-Comp Company, making sure our products are manufactured with the best quality standards and on time delivery to Customer. Process/Layout improvements, using Lean methodology to increase production efficiency, Headcount optimization improving process methods, new tooling and automating Functional Testers to avoid false rejects and Operator dependency. New Product Introduction, Layout setup, Capacity Analysis, BOM Setup, Equipment/Workstations setup DFM, WIs. Lean Manufacturing/Continuous Improvement implementation at Factory, weekly meetings to review Lean Project Initiatives. Improving Diagnostic Troubleshooting guides to increase FPY and implement new Rework method tools to reduce scrap rates. VSM identified the Functional Testers as Bottleneck, then collaborate with MTE to optimize Test times. Materials on Time and Quality deliver, leading weekly meetings with OEM and Regional Suppliers to improve in both. On Site Physical Inventory to measure stock accuracy on Critical Parts and get CA/PA from Factory for improvements. Logistics improvement on Transportation cost and on time delivery, mediator between OEM and Logistics Contractor. Follow up with Factory on RMA units, Failure/Root Cause Analysis and Corrective/Preventive Actions in place to reduce Customer Complaints. 8Ds/SCARs meetings with the Factory for Improvements Action plan and reduce Internal Audits Non-Conformances.

Overseeing all different Business Units: Seagate, DirecTV, Best Buy, Motorola, HTC, RIM and Microsoft. And managing from 40 to 150 Employees covering all Engineering areas (Process, Product, Industrial, Test Engineering, Training, Continuous Improvement and Failure Analysis). And applying concepts of continuous improvement based on Lean Six Sigma methodology to make more efficient processes. Develop and implement KPI to meet and exceed business goals. Leading efforts to launch New Product Introduction (NPI) and set up of new Production Lines including Line Lay-out, Test Equipment, Tooling and defining Bill of Materials, product/component specifications/consumption. Perform root-cause analysis and other problem-solving activities to identify effective corrective and preventive actions.Selected Achievements: Monthly Production volume increment from 70K to 300K, improving the process flow with 1-piece flow, shortening process steps and reducing the training time for a faster production ramp up. Yields Improvement from 50% to 95%, with the creation of Failure Analysis Line, assigning expert FA Techs to analyze hard to repair units creating effective Troubleshooting guides/Auto Cookbook implementation. Layout Improvement to free up space for new Business Units (~100K Sq. Ft.) implementing Lean processes and optimizing Human and hardware resources. Quality defects per million reduction, creating new/systematic Apps to improve Process control and helping to reduce the paper/labels usage and eliminating cosmetics damages due to cleaning glue residues. Back to School Project implementation to promote Operators learning Technical stuff and get a Junior Tech promotion replacing Techs and reducing Repair cost.

Managed PCBA Process and Debug Area development in Seagate BU, leading continuous improvement projects supervising cross functional-team, including 3 Engineers, 6 Process Techs and 60 Debug Technicians that supported the Creation and Updates to Process Flows, Layouts, Process Instructions, New Products Introduction, Equipment Setup and Software deployment and reducing scrap rates with New tools and Soldering methods implementation.Selected Achievements: Debug WIP reduction from + 1000 to less than 100 and Debug Effectiveness improvement from 30% to 70%, doing Failure Analysis on Top Error Codes and Automated Cookbook creation based on findings, technical training to Debug Techs and Operators. Scrap Rates Reduction from 5% to 1% by implementing new tools and methods on Repair process (SMD, PTH and BGA Components) and teaching Employees on material handling, ESD and Rework Tools. New Product Introduction (NPI) and Production Lines transfers from US and Asia Manufacturing Centers to Mexico (Reynosa) and getting Documentation like Process Instructions, Product Specs, BOMs and then provide the Technical Training to the Team (Engineers, Techs, Trainers and Operators). Key Process Indicators (KPI) definition and measurement showing metrics and Corrective and Preventive action plan to get improvements exceeding with Customer expectation.

 Management of 30 Employees and 11 Engineers and 19 Technicians), overseeing Process and Product areas. Methods Improvement to increase productivity and Yields Improvements on Phones Diagnostic, Test and Repair. Creation and updates of Process Flows, Process Charts and Test Procedures. Failure Analysis on Repeat Return Units and Process Top Failures giving feedback to Design and Manufacturing Centers for Product improvements. New Product Introduction (Corded, Cordless and Mobile Phones). MFG PRO Shop Floor system Engineering Super User.

In Charge of Product Technicians and Failure Analyisis TechniciansSupport to Production Lines repairing Corded, Cordless and Cellular PhonesCreation and Updates of RBOMs based on historical ConsumptionMonitor Yields, Top Failures to take corrective actions based on Failure Analysis and process Analysis.

Support to Production LinesTraining to Operators on new Products and Process charts changesYields MonitoringAnalysis on Top Failures and analysis on the process

Diagnose production failures at product levelRepair Corded, Cordless and Answering System PhonesUse of Soldering Equipment like Soldering Tips Station, Hot Air System, Soldering Extraction System, etc.Use of Oscilloscopes, Multi-meter, Power Supply and Phone Line Simulators, etc.

BOMs Creation and UpdatesQuality Audits based on Cosmetics criteria and Size/dimension specsCreate Production Procedures and Materials Consumption Reports on Plastics Injection Process and Metallurgic Process.